Hafnium oxide films have been deposited on silicon substrates by metal organic chemical vapordeposition using the novel single precursor, hafnium 3-methyl-3-pentoxide {Hf[OC(CH
3)(C
2H
5)
2]
4,Hf(mp)
4}, with no additional oxygen source, and the deposition mechanism was elucidated. Hf(mp)
4 isa liquid at room temperature and has a
moderate vapor pressure comparable to that of hafnium
tert-butoxide, Hf(O
tBu)
4, and a lower residual weight (<10%) in ther
mogravimetric analysis. The depositionrate was found to be ~27 Å/min at 400
C, and the activation energy was 68.1 kJ/
mol, which is higherthan those of other hafnium alkoxide and hafnium amide precursors. By gas chromatography/massspectroscopy and nuclear magnetic resonance analyses of the thermally decomposed vapor phase productscollected during the deposition of HfO
2 films, it was clearly found that they are grown via
-hydrogenelimination processes of the Hf(mp)
4 single precursor. Negligible carbon incorporation of the HfO
2 films,examined by X-ray photoelectron spectroscopy and depth-profiling Auger electron spectroscopy, indicatesthat, except for the
-hydrogen elimination processes, no additional decomposition and/or recombinationprocesses contributed to the HfO
2 film growth. The
morphology, crystallinity, and electrical propertiesof the HfO
2 films were characterized by scanning electron microscopy, atomic force microscopy, X-raydiffraction, and capacitance-voltage and current-voltage measurements.