Electroforming of Copper Structures at Nanometer-Sized Gaps of Self-assembled Monolayers on Silver
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- 作者：Hong Yang ; J. Christopher Love ; Francisco Arias ; and George M. Whitesides
- 刊名：Chemistry of Materials
- 出版年：2002
- 出版时间：March 2002
- 年：2002
- 卷：14
- 期：3
- 页码：1385 - 1390
- 全文大小：597K
- 年卷期：v.14,no.3(March 2002)
- ISSN：1520-5002
文摘
This paper describes a method to fabricate micro- and nanostructures of copper byelectrodeposition onto nanometer-sized gaps in self-assembled monolayers (SAM) of alkanethiolates on metal surfaces. We have demonstrated that the approach can produce largenumbers of metallic micro- or nanostructures over large (2 cm2) areas with features as smallas 
70 nm. The electrodeposited copper structures can be transferred using Scotch tapeonto both flat and curved substrates. Linear arrays of copper structures have been testedfor use as optical polarizers. A polarization ratio R = 2.0 was found for light with 
= 633nm in transmission mode for linear arrays of copper wires (220 nm, with a 1-
m pitch)mounted on antireflective windows.
70 nm. The electrodeposited copper structures can be transferred using Scotch tapeonto both flat and curved substrates. Linear arrays of copper structures have been testedfor use as optical polarizers. A polarization ratio R = 2.0 was found for light with = 633nm in transmission mode for linear arrays of copper wires (220 nm, with a 1-m pitch)mounted on antireflective windows.