The growth of Al
2O
3 onto Sn-doped In
2O
3 (ITO) by atomic layer deposition (ALD) was studied in situ using X-ray photoelectron spectroscopy. Significant diffusion of oxygen from the substrate destroys the self-terminated monolayer adsorption of the metal precursor and results in a nominal initial growth per cycle of >1 nm. The observed mechanism precludes the preparation of monolayer thick Al
2O
3 films on ITO substrates by ALD. The energy band alignment at the ITO/Al
2O
3 interface is significantly different from that obtained when magnetron sputtering is used for the deposition of Al
2O
3 onto ITO [Gassenbauer et al.,
Phys. Chem. Chem. Phys.2009,
11, 3049]. The difference is attributed to a pinning of the Fermi level in the ALD-Al
2O
3 layer close to midgap, which is attributed to the incorporation of hydrogen in the film during growth.
Keywords:
indium鈭抰in oxide; AL2O3; atomic layer deposition; initial growth; interface properties; band alignment; hydrogen impurity