Inkjet Fabrication of Copper Patterns for Flexible Electronics: Using Paper with Active Precoatings

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• 作者：Thomas 脰hlund ; Anna K. Schuppert ; Magnus Hummelg氓rd ; Joakim B盲ckstr枚m ; Hans-Erik Nilsson ; H氓kan Olin
• 刊名：ACS Applied Materials & Interfaces
• 出版年：2015
• 出版时间：August 26, 2015
• 年：2015
• 卷：7
• 期：33
• 页码：18273-18282
• 全文大小：494K
• ISSN：1944-8252

文摘

Low-cost solution-processing of highly conductive films is important for the expanding market of printed electronics. For roll-to-roll manufacturing, suitable flexible substrates and compatible postprocessing are essential. Here, custom-developed coated papers are demonstrated to facilitate the inkjet fabrication of high performance copper patterns. The patterns are fabricated in ambient conditions using water-based CuO dispersion and intense pulsed light (IPL) processing. Papers using a porous CaCO₃ precoating, combined with an acidic mesoporous absorption coating, improve the effectiveness and reliability of the IPL process. The processing is realizable within 5 ms, using a single pulse of light. A resistivity of 3.1 卤 0.12 渭惟路cm is achieved with 400 渭m wide conductors, corresponding to more than 50% of the conductivity of bulk copper. This is higher than previously reported results for IPL-processed copper.