Vertically Stacked Color Tunable Light-Emitting Diodes Fabricated Using Wafer Bonding and Transfer Printing
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- 作者：Jaeyi Chun ; Kwang Jae Lee ; Young-Chul Leem ; Won-Mo Kang ; Tak Jeong ; Jong Hyeob Baek ; Hyung Joo Lee ; Bong-Joong Kim ; Seong-Ju Park
- 刊名：ACS Applied Materials & Interfaces
- 出版年：2014
- 出版时间：November 26, 2014
- 年：2014
- 卷：6
- 期：22
- 页码：19482-19487
- 全文大小：338K
- ISSN：1944-8252
文摘
We report on the vertically stacked color tunable light-emitting diodes (LEDs) fabricated using wafer bonding with an indium tin oxide (ITO) layer and transfer printing by the laser lift-off process. Employing optically transparent and electrically conductive ITO as an adhesion layer enables to bond the GaN-based blue and AlGaInP-based yellow LEDs. We find out that the interdiffusion of In, O, and Ga at the interface between ITO and GaP allows the strong bonding of the heterogeneous optoelectronic materials and the integration of two different color LEDs on a single substrate. The efficacy of this method is demonstrated by showing the successful control of color coordinate from the vertically stacked LEDs by modulating the individual intensity of blue and yellow emissions.