Fabrication of Large-Area Hierarchical Structure Array Using Siliconized-Silsesquioxane as a Nanoscale Etching Barrier

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• 作者：Bong Kuk Lee ; In-Bok Baek ; Yarkyeon Kim ; Won Ick Jang ; Yong Sun Yoon ; Han Young Yu
• 刊名：ACS Applied Materials & Interfaces
• 出版年：2015
• 出版时间：June 24, 2015
• 年：2015
• 卷：7
• 期：24
• 页码：13490-13496
• 全文大小：511K
• ISSN：1944-8252

文摘

A material approach to fabricate a large-area hierarchical structure array is presented. The replica molding and oxygen (O₂) plasma etching processes were combined to fabricate a large-area hierarchical structure array. Liquid blends consisting of siliconized silsesquioxane acrylate (Si-SSQA), ethylene glycol dimethacrylate (EGDMA), and photoinitiator are developed as a roughness amplifying material during O₂ plasma etching. Microstructures composed of the Si-SSQA/EGDMA mixtures are fabricated by replica molding. Nanoscale roughness on molded microstructures is realized by O₂ etching. The nanoscale roughness on microstructures is efficiently controlled by varying the etching time and the weight ratio of Si-SSQA to EGDMA. The hierarchical structures fabricated by combining replica molding and O₂ plasma etching showed superhydrophilicity with long-term stability, resulting in the formation of hydroxyl-terminated silicon oxide layer with the reorientation limit. On the other hand, the hierarchical structures modified with a perfluorinated monolayer showed superhydrophobicity. The increment of water contact angles is consistent with increment of the nano/microroughness of hierarchical structures and decrement of the top contact area of water/hierarchical structures.