Magnetic Field Effects on Copper Metal Deposition from Copper Sulfate Aqueous Solution

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• 作者：Chikako Udagawa ; Aya Maeda ; Akio Katsuki ; Syou Maki ; Shotaro Morimoto ; Yoshifumi Tanimoto
• 刊名：Journal of Physical Chemistry B
• 出版年：2014
• 出版时间：May 8, 2014
• 年：2014
• 卷：118
• 期：18
• 页码：4889-4894
• 全文大小：255K
• 年卷期：v.118,no.18(May 8, 2014)
• ISSN：1520-5207

文摘

Effects of a magnetic field (鈮?.5 T) on electroless copper metal deposition from the reaction of a copper sulfate aqueous solution and a zinc thin plate were examined in this study. In a zero field, a smooth copper thin film grew steadily on the plate. In a 0.38 T field, a smooth copper thin film deposited on a zinc plate within about 1 min. Then, it peeled off repeatedly from the plate. The yield of consumed copper ions increased about 2.1 times compared with that in a zero field. Mechanism of this magnetic field effect was discussed in terms of Lorentz force- and magnetic force-induced convection and local volta cell formation.