Atomic layer deposition (ALD) of HfO
2 thin films was studied using four novel cyclopentadienylprecursors, namely, (CpMe)
2HfMe
2, Cp
2Hf(OMe)
2, (CpMe)
2Hf(OMe)Me, and (CpMe)
2Hf(OMe)
2. Ozonewas used as the oxygen source. Among the cyclopentadienyl precursors, (CpMe)
2HfMe
2 and (CpMe)
2Hf(OMe)Me were the most promising, showing ALD-type growth characteristics at high temperaturesas the self-limiting growth mode was confirmed at 400
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C. ALD-type growth was verified also on 60:1aspect ratio trench structures even at 450
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C, where perfect conformality was obtained. The growth ratestayed nearly constant at around 0.5 Å/cycle at substrate temperatures between 350 and 500
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C. WhenCp
2Hf(OMe)
2 and (CpMe)
2Hf(OMe)
2 were applied, slight decomposition of the precursor was detectedat 350-400
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C, and thus a self-limiting growth mode was not achieved. Time-of-flight elastic recoildetection analyses demonstrated stoichiometric HfO
2 films, where impurity concentrations were below0.1 at % for C, H, and N in films deposited from each of the four Hf precursors. In addition, thin HfO
2films showed good dielectric properties such as low hysteresis, nearly ideal flatband voltage, and effectivepermittivity values similar to previously reported HfO
2 films obtained by the alkylamide-based processes.