文摘
A novel process called 鈥渄ouble exposure method鈥?has for the first time been developed to utilize common organic materials as insulating layers at low annealing temperature in the process of photolithography. In this method, organic dielectric layer will not dissolve in the final lift-off step by using developer to replace traditional acetone. Bottom-gate bottom-contact (BGBC) OFETs are fabricated on the flexible PET substrates with polystyrene (PS) and pentacene as dielectric layer and semiconductor layer, respectively. Transistors with mobility of 0.36 cm2 V鈥? s鈥? and logic inverter with gain of 9 on the plastic substrates have been fabricated, demonstrating the potential appliction of 鈥渄ouble exposure method鈥?in flexible organic electronics.
Keywords:
double exposure; polystyrene; flexible; OFETs; organic circuits