Demonstration of Strong Near-Field Radiative Heat Transfer between Integrated Nanostructures
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- 作者：Raphael St-Gelais ; Biswajeet Guha ; Linxiao Zhu ; Shanhui Fan ; Michal Lipson
- 刊名：Nano Letters
- 出版年：2014
- 出版时间：December 10, 2014
- 年：2014
- 卷：14
- 期：12
- 页码：6971-6975
- 全文大小：294K
- ISSN：1530-6992
文摘
Near-field heat transfer recently attracted growing interest but was demonstrated experimentally only in macroscopic systems. However, several projected applications would be relevant mostly in integrated nanostructures. Here we demonstrate a platform for near-field heat transfer on-chip and show that it can be the dominant thermal transport mechanism between integrated nanostructures, overcoming background substrate conduction and the far-field limit (by factors 8 and 7, respectively). Our approach could enable the development of active thermal control devices such as thermal rectifiers and transistors.