Selective Desoldering Separation of Tin鈥揕ead Alloy for Dismantling of Electronic Components from Printed Circuit Boards

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• 作者：Xiaojiao Zhang ; Jie Guan ; Yaoguang Guo ; Xingru Yan ; Hao Yuan ; Jinqiu Xu ; Jiang Guo ; Yuan Zhou ; Ruijing Su ; Zhanhu Guo
• 刊名：ACS Sustainable Chemistry & Engineering
• 出版年：2015
• 出版时间：August 3, 2015
• 年：2015
• 卷：3
• 期：8
• 页码：1696-1700
• 全文大小：356K
• ISSN：2168-0485

文摘

Desoldering separation of solder from waste printed circuit boards (PCBs) is a key step to recycle or dispose the electronic waste effectively. In the present work, a novel way for selective desoldering separation was achieved by dissolving lead鈥搕in solder in fluoroboric acid containing H<sub>2sub>O<sub>2sub>. This leachant was observed possible to take the solder into solution with negligible dissolution of copper or other metals within 35 min. After leaching, the electronic components (ECs) could be easily removed from the boards under good experiment conditions. The effects of oxidants, dosage of H<sub>2sub>O<sub>2sub>, and acid concentration were explored to obtain the suitable experimental conditions. The results showed that 2.5 mol/L fluoroboric acid containing 0.4 mol/L added oxidant H<sub>2sub>O<sub>2sub> within the reaction of 35 min could be regarded as the optimum conditions for the selective desoldering separation from the waste PCBs. Both theoretical analysis using HSC Chemistry software and actual waste PCBs examination verified that the solder could be dissolved selectively by this novel process via excess solder added to inhibit the effect of copper dissolution if exists. This safe, fast, economic, and environmentally friendly dismantling PCBs process would be of great importance in recycling waste electrical and electronic equipment (EEE) effectively.