Extremely Superhydrophobic Surfaces with Micro- and Nanostructures Fabricated by Copper Catalytic Etching

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• 作者：Jung-Pil Lee ; Sinho Choi ; Soojin Park
• 刊名：Langmuir
• 出版年：2011
• 出版时间：January 18, 2011
• 年：2011
• 卷：27
• 期：2
• 页码：809-814
• 全文大小：1001K
• 年卷期：v.27,no.2(January 18, 2011)
• ISSN：1520-5827

文摘

We demonstrate a simple method for the fabrication of rough silicon surfaces with micro- and nanostructures, which exhibited superhydrophobic behaviors. Hierarchically rough silicon surfaces were prepared by copper (Cu)-assisted chemical etching process where Cu nanoparticles having particle size of 10鈭?0 nm were deposited on silicon surface, depending on the period of time of electroless Cu plating. Surface roughness was controlled by both the size of Cu nanoparticles and etching conditions. As-synthesized rough silicon surfaces showed water contact angles ranging from 93掳 to 149掳. Moreover, the hierarchically rough silicon surfaces were chemically modified by spin-coating of a thin layer of Teflon precursor with low surface energy. And thus it exhibited nonsticky and enhanced hydrophobic properties with extremely high contact angle of nearly 180掳.