Facile Route Toward Mechanically Stable Superhydrophobic Copper Using Oxidation鈥揜eduction Induced Morphology Changes

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• 作者：Seung-Mo Lee ; Kwang-Seop Kim ; Eckhard Pippel ; Sangmin Kim ; Jae-Hyun Kim ; Hak-Joo Lee
• 刊名：The Journal of Physical Chemistry C
• 出版年：2012
• 出版时间：February 2, 2012
• 年：2012
• 卷：116
• 期：4
• 页码：2781-2790
• 全文大小：741K
• 年卷期：v.116,no.4(February 2, 2012)
• ISSN：1932-7455

文摘

We present that the morphological change induced by an oxidation鈥搑eduction reaction can be effectively employed for easily producing superhydrophobic copper without any use of hydrophobic agents. By thermal oxidation of copper, needle-shaped copper oxide nanowires (NWs) were grown on the copper substrate. Subsequent reduction led to wavy copper NW structures, which exhibited superhydrophobic properties (contact angle of over 160掳 and sliding angle of less than 2掳). We found that the water adhesion behavior on a surface could markedly vary with the shape of miniature structures of the surface, presumably due to the pinning effect. Microstructure, element, and surface analyses indicated that the outermost layer (脜) of the resulting copper NWs is mainly composed of Cu₂O. Furthermore, the resulting superhydrophobic copper structures were observed to have good mechanical stability as well as chemical stability. This simple and scalable method could potentially be adopted in industry or academia where research on anticorrosion, antibiofouling, or drag reduction of copper-based objects is performed.