Cleavable Ligands Enable Uniform Close Packing in Colloidal Quantum Dot Solids

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• 作者：Graham H. Carey ; Mingjian Yuan ; Riccardo Comin ; Oleksandr Voznyy ; Edward H. Sargent
• 刊名：ACS Applied Materials & Interfaces
• 出版年：2015
• 出版时间：October 7, 2015
• 年：2015
• 卷：7
• 期：39
• 页码：21995-22000
• 全文大小：296K
• ISSN：1944-8252

文摘

Uniform close packing in colloidal quantum dot solids is critical for high-optical density, high-mobility optoelectronic devices. A hybrid-ligand strategy is developed, combining the advantages of solid state and solution-phase ligand exchanges. This strategy uses a medium length thioamide ligand that is readily cleaved in a single chemical treatment, leading to quantum dot solids with uniformly packed domains 3 times larger than those observed in ligand-exchanged films.