Preparation and characterization of ultrananocrystalline diamond films in H2/Ar/CH4 gas mixtures system with novel filament structure

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• 作者：Jie Feng 丰杰 ; Sha-sha Li 李莎茿/a> ; Hao Luo 罗浩…
• 刊名：Journal of Central South University
• 出版年：2015
• 出版时间：November 2015
• 年：2015
• 卷：22
• 期：11
• 页码：4097-4104
• 全文大小：1,668 KB
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• 作者单位：Jie Feng 丰杰 (1) (2)
  Sha-sha Li 李莎莎 (1)
  Hao Luo 罗浩 (1)
  Qiu-ping Wei 魏秋平 (1) (3)
  Bing Wang 王兵 (4)
  Jian-guo Li 李建国 (2)
  Dong-ping Hu 胡东平 (2)
  Jun Mei 梅军 (2)
  Zhi-ming Yu 余志明 (1) (3)
  
  1. School of Materials Science and Engineering, Central South University, Changsha, 410083, China
  2. Institute of Systems Engineering, China Academy of Engineering Physics, Mianyang, 621900, China
  3. State Key Laboratory of Powder Metallurgy (Central South University), Changsha, 410083, China
  4. School of Materials Science and Engineering, Southwest University of Science and Technology, Mianyang, 621010, China
  
• 刊物类别：Engineering
• 刊物主题：Engineering, general
  Metallic Materials
  Chinese Library of Science
  
• 出版者：Central South University, co-published with Springer
• ISSN：2227-5223

文摘

Diamond films were prepared by hot filament chemical vapor deposition (HFCVD) in a gas mixtures system of methane, argon and hydrogen. The composition and morphology in different deposition pressures and filament structures were investigated, as well as the friction and wear-resistant properties. The sp3-bonded content was measured and nano-mechanics properties were also tested. Results of atomic force microscopy and X-ray photoelectron spectroscopy show that the diamond films whose surface roughness is less than 10 nm and sp3-bonded content is greater than 70% can be prepared by bistratal filament structure with optimized proportion of Ar. It is also shown that the friction coefficient of diamond films is 0.13 and its wear-resistant property is excellent. Nano-mechanics of films shows that its elastic modulus is up to 650 MPa and hardness can reach higher than 60 GPa. The diamond films with excellent performance have a broad application prospect in microelectromechanical systems (MEMS).