Effect of aluminum anodizing in phosphoric acid electrolyte on adhesion strength and thermal performance

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• 作者：Sulki Lee ; Donghyun Kim ; Yonghwan Kim ; Uoochang Jung…
• 关键词：anodization ; metal core printed circuit boards ; adhesives ; bonding strength ; thermal analysis
• 刊名：Metals and Materials International
• 出版年：2016
• 出版时间：January 2016
• 年：2016
• 卷：22
• 期：1
• 页码：20-25
• 全文大小：558 KB
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• 作者单位：Sulki Lee (1)
  Donghyun Kim (1)
  Yonghwan Kim (2)
  Uoochang Jung (2)
  Wonsub Chung (1)
  
  1. Department of Materials Science and Engineering, Pusan National University, Busan, 609-735, Republic of Korea
  2. Korea Institute of Industrial Technology (KITECH), Busan, 618-230, Republic of Korea
  
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Metallic Materials
  Operating Procedures and Materials Treatment
  
• 出版者：The Korean Institute of Metals and Materials, co-published with Springer Netherlands
• ISSN：2005-4149

文摘

This study examined the adhesive bond strength and thermal performance of the anodized aluminum 6061 in phosphoric acid electrolyte to improve the adhesive bond strength and thermal performance for use in metal core printed circuit boards (MCPCB). The electrolyte temperature and applied voltage were altered to generate varied pore structures. The thickness, porosity and pore diameter of the anodized layer were measured. The pore morphologies were affected most by temperature, which was the driving force for ion transportation. The mechanism of adhesive bond was penetration of the epoxy into the pores. The optimal anodization conditions for maximum adhesive bond strength, 27 MPa, were 293 K and 100V. The maximum thermal conductivity of the epoxy-treated anodized layer was 1.6 W/m·K at 273 K. Compared with the epoxy-treated Al layer used for conventional MCPCBs, the epoxy-treated anodized layer showed advanced thermal performance due to a low difference of thermal resistance and high heat dissipation. Keywords anodization metal core printed circuit boards adhesives bonding strength thermal analysis