The Influence of Cu on Metastable NiSn4 in Sn-3.5Ag-xCu/ENIG Joints

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• 作者：S. A. Belyakov ; C. M. Gourlay
• 关键词：Microstructure ; Pb ; free soldering ; metastable ; NiSn4 ; intermetallics ; solidification
• 刊名：Journal of Electronic Materials
• 出版年：2016
• 出版时间：January 2016
• 年：2016
• 卷：45
• 期：1
• 页码：12-20
• 全文大小：2,220 KB
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• 作者单位：S. A. Belyakov (1)
  C. M. Gourlay (1)
  
  1. Department of Materials, Imperial College, London, SW7 2AZ, UK
  
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Chemistry
  Optical and Electronic Materials
  Characterization and Evaluation Materials
  Electronics, Microelectronics and Instrumentation
  Solid State Physics and Spectroscopy
  
• 出版者：Springer Boston
• ISSN：1543-186X

文摘

We have investigated the effect of small amounts of Cu on suppression of metastable βSn-NiSn₄ eutectic growth in solder joints between Sn-3.5Ag-xCu solders and Ni-based substrates. For Sn-3.5Ag/electroless nickel immersion gold (ENIG) and Sn-3.5Ag/Ni solder joints we showed that the eutectic mixture contains βSn, Ag₃Sn, and metastable NiSn₄. It was found that addition of only 0.005 wt.% Cu to Sn-3.5Ag-xCu/ENIG or Sn-3.5Ag-xCu/Ni joints promoted formation of a stable βSn-Ni₃Sn₄ eutectic and that both Ni₃Sn₄ and NiSn₄ occur in the eutectic at this Cu level. We also showed that for complete prevention of formation of metastable NiSn₄ during eutectic solidification of the solder joint, addition of at least 0.3 wt.% Cu was required.