Controlling Bulk Cu6Sn5 Nucleation in Sn0.7Cu/Cu Joints with Al Micro-alloying

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• 作者：J. W. Xian ; S. A. Belyakov ; C. M. Gourlay
• 关键词：Pb ; free soldering ; grain refinement ; intermetallics ; crystal growth ; orientation relationship (OR) ; heterogeneous nucleation
• 刊名：Journal of Electronic Materials
• 出版年：2016
• 出版时间：January 2016
• 年：2016
• 卷：45
• 期：1
• 页码：69-78
• 全文大小：3,844 KB
• 参考文献：1.I.E. Anderson, J.W. Walleser, J.L. Harringa, F. Laabs, and A. Kracher, J. Electron. Mater. 38, 2770 (2009).CrossRef
  2.A. Kantarcıoğlu and Y.E. Kalay, Mater. Sci. Eng. A 593, 79 (2014).CrossRef
  3.H.R. Kotadia, O. Mokhtari, M. Bottrill, M.P. Clode, M.A. Green, and S.H. Mannan, J. Electron. Mater. 39, 2720 (2010).CrossRef
  4.A.J. Boesenberg, I.E. Anderson, and J.L. Harringa, J. Electron. Mater. 41, 1868 (2012).CrossRef
  5.K.N. Reeve, I.E. Anderson, and C.A. Handwerker, J. Electron. Mater. 44, 842 (2015).CrossRef
  6.H.R. Kotadia, A. Panneerselvam, O. Mokhtari, M.A. Green, and S.H. Mannan, J. Appl. Phys. 111, 074902 (2012)
  7.J.W. Xian, S.A. Belyakov, T.B. Britton, and C.M. Gourlay, J. Alloys Compd. 619, 345 (2015).CrossRef
  8.S. McDonald, K. Nogita, J. Read, T. Ventura, and T. Nishimura, J. Electron. Mater. 42, 256 (2013).CrossRef
  9.E.H. Kisi and J.D. Browne, Acta Crystallogr. Sect. B 47, 835 (1991).CrossRef
  10.L. Arnberg and S. Westman, Acta Crystallogr. Sect. A 34, 399 (1978).CrossRef
  11.Thermo-Calc, TCSLD Database version 3.0, (2015)
  12.N. Ponweiser, C.L. Lengauer, and K.W. Richter, Intermetallics 19, 1737 (2011).CrossRef
  13.M.G. Cho, S.K. Seo, and H.M. Lee, Mater. Trans. 50, 2291 (2009).CrossRef
  14.Y.-C. Huang, S.-W. Chen, and K.-S. Wu, J. Electron. Mater. 39, 109 (2010).CrossRef
  15.P. Zhou, H.J. Kang, F. Cao, Y.A. Fu, T.Q. Xiao, and T.M. Wang, J. Mater. Sci.: Mater. Electron. 25, 4538 (2014).
  16.B. Peplinski, G. Schulz, D. Schultze, and E. Schierhorn, Mater. Sci. Forum 228, 577 (1996).CrossRef
  17.K. Nogita, C.M. Gourlay, and T. Nishimura, JOM 61, 45 (2009).CrossRef
  18.K. Nogita, C.M. Gourlay, S.D. McDonald, Y.Q. Wu, J. Read, and Q.F. Gu, Scripta Mater. 65, 922 (2011).CrossRef
  19.A.K. Larsson, L. Stenberg, and S. Lidin, Acta Crystallogr. Sect. B 50, 636 (1994).CrossRef
  
• 作者单位：J. W. Xian (1)
  S. A. Belyakov (1)
  C. M. Gourlay (1)
  
  1. Department of Materials, Imperial College, London, SW7 2AZ, UK
  
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Chemistry
  Optical and Electronic Materials
  Characterization and Evaluation Materials
  Electronics, Microelectronics and Instrumentation
  Solid State Physics and Spectroscopy
  
• 出版者：Springer Boston
• ISSN：1543-186X

文摘

We show that dilute Al additions can control the size of primary Cu₆Sn₅ rods in Sn-0.7Cu/Cu ball grid array joints. In Sn-0.7Cu-0.05Al/Cu joints, the number of primary Cu₆Sn₅ per mm2 is ∼7 times higher and the mean three-dimensional length of rods is ∼4 times smaller than in Al-free Sn-0.7Cu/Cu joints, while the area fraction of primary Cu₆Sn₅ is similar. It is shown that epitaxial nucleation of primary Cu₆Sn₅ occurs on δ-Cu₃₃Al₁₇ or γ ₁-Cu₉Al₄ particles, which are stable␣in the Sn-0.7Cu-0.05Al melt during holding at 250°C. The observed facet relationships agree well with previously determined orientation relationships between δ-Cu₃₃Al₁₇ and Cu₆Sn₅ in hypereutectic Sn-Cu-Al alloys and result in a good lattice match with <∼2.5% lattice mismatch on two different interfacial planes.