文摘
In this paper, we have developed a fabrication process for micro synthetic jet actuators (SJA) by bonding a high-quality Pb (Zr,Ti) O3 (PZT) ceramic wafer to a silicon wafer using epoxy resin at low temperature (<150?°C). The bulk-PZT was lapped and polished to be PZT thick film by chemical mechanical polishing (CMP) method, and patterned by wet-etching method. The cavity and orifice of SJA were formed by inductive coupled plasma etching (ICP) method. A MEMS piezoelectric SJA was then completed and characterized, including the performance of the PZT thick film. While the dimension of bonded PZT thick film is about 6,000?×?6,000?×?100?μm, and the dimension of Si membrane is about 1,000?×?1,000?×?20?μm. The experimental results show that the maximum center amplitude of PZT-Si diaphragm is 15.05?μm at Vp-p of 90?V and the resonant frequency of 5?kHz, and the maximum jet velocity is higher than 11?m/s. This novel process has great potential to fabricate MEMS piezoelectric synthetic jet actuators.