Effect of bonding pressure on microstructure and mechanical properties of Ti-6Al-4V diffusion-bonded joint

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• 作者：M. Samavatian ; S. Zakipour ; M. Paidar
• 关键词：(IIW Thesaurus)Diffusion bonding ; Microstructure ; Mechanical properties ; Diffusion ; Pressure
• 刊名：Welding in the World
• 出版年：2017
• 出版时间：January 2017
• 年：2017
• 卷：61
• 期：1
• 页码：69-74
• 全文大小：
• 刊物主题：Metallic Materials; Continuum Mechanics and Mechanics of Materials; Theoretical and Applied Mechanics;
• 出版者：Springer Berlin Heidelberg
• ISSN：1878-6669
• 卷排序：61

文摘

In this study, solid-state diffusion bonding of Ti-6Al-4V alloy using a pure copper interlayer was conducted, and the effect of bonding pressure (0.5 to 4 MPa) on microstructure and mechanical properties was investigated. The joint zones were analyzed by optical microscope (OM) and scanning electron microscope (SEM), and microhardness and shear strength tests were also employed to evaluate mechanical behaviors of the joints. The results showed that diffusion of Cu into the Ti alloy led to the formation and the stability of β-Ti as a strengthening phase in the joint zone. Moreover, the increase in bonding pressure made the joint width be decreased to the minimum value. The maximum shear strength of 571 MPa was achieved for the bond made with 4 MPa bonding pressure, whereas with a decrease in pressure, the shear strength fell to 358 MPa that could be attributed to the increase in the joint width and the formation of brittle intermetallic compounds at the interface.