A Technique for the Experimental Determination of the Length and Strength of Adhesive Interactions Between Effectively Rigid Materials
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  • 作者:Tevis D. B. Jacobs ; Joel A. Lefever ; Robert W. Carpick
  • 关键词:Adhesion ; Nanoscale ; Work of adhesion ; Range of adhesion AFM ; TEM
  • 刊名:Tribology Letters
  • 出版年:2015
  • 出版时间:July 2015
  • 年:2015
  • 卷:59
  • 期:1
  • 全文大小:1,191 KB
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  • 作者单位:Tevis D. B. Jacobs (1)
    Joel A. Lefever (2)
    Robert W. Carpick (3)

    1. Department of Mechanical Engineering and Materials Science, University of Pittsburgh, 538-E Benedum Hall, 3700 O’Hara St., Pittsburgh, PA, 15261, USA
    2. Department of Materials Science and Engineering, University of Pennsylvania, 3231 Walnut St., Philadelphia, PA, 19104, USA
    3. Department of Mechanical Engineering and Applied Mechanics, University of Pennsylvania, 229 Towne Bldg, 220 S. 33rd St., Philadelphia, PA, 19104, USA
  • 刊物类别:Chemistry and Materials Science
  • 刊物主题:Chemistry
    Tribology, Corrosion and Coatings
    Surfaces and Interfaces and Thin Films
    Theoretical and Applied Mechanics
    Physical Chemistry
    Nanotechnology
  • 出版者:Springer Netherlands
  • ISSN:1573-2711
文摘
To describe adhesion between bodies of known arbitrary shape and known elastic properties, contact mechanics models require knowledge or assumptions of a minimum of two parameters, the strength of the adhesive interaction (characterized by the intrinsic work of adhesion W adh,int) and the length scale of the interaction (described by the range of adhesion z 0). One parameter can easily be measured if the other is estimated or assumed, but experimental techniques for determining both simultaneously are lacking. Here, we demonstrate a novel technique—called the Snap-in/pull-off Numerical Adhesion Parameter method—for experimentally determining both parameters simultaneously using adhesion measurements performed with an atomic force microscope probe whose geometry has been characterized. The method applies to materials that approach the rigid limit (high elastic moduli). The technique is explained and validated analytically for simple shapes (flat punch, paraboloid, and right cone), and trends in results are compared against prior literature. This approach allows calculation of the adhesion parameters to enable prediction of adhesion behavior, including for advanced technology applications.

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