Development of hot embossing stamps with conformal cooling channels for microreplication

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• 作者：Chil-Chyuan Kuo ; Bing-Cheng Chen
• 关键词：Embossing stamps ; Conformal cooling channels ; Microreplication
• 刊名：The International Journal of Advanced Manufacturing Technology
• 出版年：2017
• 出版时间：February 2017
• 年：2017
• 卷：88
• 期：9-12
• 页码：2603-2608
• 全文大小：
• 刊物类别：Engineering
• 刊物主题：Industrial and Production Engineering; Media Management; Mechanical Engineering; Computer-Aided Engineering (CAD, CAE) and Design;
• 出版者：Springer London
• ISSN：1433-3015
• 卷排序：88

文摘

Hot embossing stamp fabricated from aluminum-filled epoxy resin can be employed for short-run productions. However, the cooling time is much longer compared to metallic stamps due to poorer thermal conductivity. Therefore, developing a hot embossing stamp with high cooling efficiency is an important issue. In this study, three different cooling-channel layouts were employed to fabricate hot embossing stamps using rapid prototyping and rapid tooling techniques. Effects of different hot embossing stamps on the cooling time during hot embossing molding were investigated. It was found that the reduction in cooling time about 92 % can be obtained when a hot embossing stamp with conformal cooling channels compared to the hot embossing stamp without cooling channels. The manufacturing cost reduction for a micro-featured hot embossing stamp with high cooling efficiency about 72 % can be obtained using the method proposed in this work.