Study on curing kinetics of diglycidyl 1,2-cyclohexane dicarboxylate epoxy/episulfide resin system with hexahydro-4-methylphthalic anhydride as a curing agent

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• 作者：Chongfeng Zhang ; Xiaodong Liu ; Jue Cheng…
• 关键词：Epoxy/episulfide resins ; Non ; isothermal DSC ; Vyazovkin method ; Málek method ; FWO method
• 刊名：Journal of Thermal Analysis and Calorimetry
• 出版年：2015
• 出版时间：June 2015
• 年：2015
• 卷：120
• 期：3
• 页码：1893-1903
• 全文大小：1,416 KB
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• 作者单位：Chongfeng Zhang (1)
  Xiaodong Liu (1)
  Jue Cheng (1)
  Junying Zhang (1)
  
  1. Key Laboratory of Carbon Fiber and Functional Polymers, Ministry of Education, Beijing University of Chemical Technology, Beijing, 100029, People’s Republic of China
  
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Chemistry
  Sciences
  Polymer Sciences
  Physical Chemistry
  Inorganic Chemistry
  Measurement Science and Instrumentation
  
• 出版者：Akad茅miai Kiad贸, co-published with Springer Science+Business Media B.V., Formerly Kluwer Academic
• ISSN：1572-8943

文摘

The curing kinetics of the hexahydro-4-methylphthalic anhydride (MHHPA)/diglycidyl 1,2-cyclohexane dicarboxylate (CY184) epoxy resin system and MHHPA/CY184 epoxy/episulfide resin system (containing 2?mass% DMP-30 as an accelerator) was comparatively investigated by non-isothermal differential scanning calorimetry with a model-fitting Málek method and a model-free advanced isoconversional method of Vyazovkin, and the curing behavior was discussed based on the proposed curing mechanism. The results indicated that both of the MHHPA/CY184 epoxy resin system and MHHPA/CY184 epoxy/episulfide resin system fitted ?esták–Berggren model. The activation energy of MHHPA/CY184 epoxy/episulfide resin system was lower than that of MHHPA/CY184 epoxy resin system, suggesting that the episulfide resin has higher reactivity and can accelerate the reaction. The value of m in the kinetic model equation in MHHPA/CY184 epoxy/episulfide resin system is much smaller than that in MHHPA/CY184 epoxy resin system, indicating, unlike the MHHPA/CY184 epoxy resin system, MHHPA/CY184 epoxy/episulfide resin system has much less autocatalytic effect.