A Method of Stray Grain Suppression for Single-Crystal Superalloy During Seed Melt-Back

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• 作者：Weidong Xuan ; Jian Lan ; Huan Liu ; Chuanjun Li…
• 刊名：Metallurgical and Materials Transactions A
• 出版年：2016
• 出版时间：December 2016
• 年：2016
• 卷：47
• 期：12
• 页码：5691-5697
• 全文大小：2,171 KB
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Chemistry
  Materials Science
  Metallic Materials
  Structural Materials
  Physical Chemistry
  Ceramics,Glass,Composites,Natural Materials
  
• 出版者：Springer Boston
• ISSN：1543-1940
• 卷排序：47

文摘

The suppression of stray grains during seed melt-back of single-crystal superalloy through thermal resistance technique has been investigated based on both experimental observations and numerical simulation. The results indicate that the introduction of thermal resistance layer significantly suppresses the stray grain formation of single-crystal superalloy. Based on both theoretical analysis and numerical simulation, above results should be attributed to the decrease of radial heat transfer of sample in the thermal resistance layer.