刊名:Analog Integrated Circuits and Signal Processing
出版年:2016
出版时间:March 2016
年:2016
卷:86
期:3
页码:385-391
全文大小:6,515 KB
参考文献:1.Agarwal, M., Park, K., Hopcroft, M., Chandorkar, S., Candler, R., Kim, B., Melamud, R., Yama, G., Murmann, B., Kenny, T. (2006). Effects of mechanical vibrations and bias voltage noise on phase noise of MEMS resonator based oscillators. In 19th IEEE international conference on micro electro mechanical systems, 2006 (pp. 154--157). Istanbul: MEMS 2006. doi:10.1109/MEMSYS.2006.1627759 . 2.Asl, S., Mukherjee, S., Chen, W., Joo, K., Palwai, R., Arumugam, N., Galle, P., Phadke, M., Grosjean, C., Salvia, J., Lee, H., Pamarti, S., Fiez, T., Makinwa, K., Partridge, A., Menon, V. (2014) 12.9 A 1.55 × 0.85 mm2 3 ppm 1.0 μA 32.768 khz MEMS-based oscillator. In 2014 IEEE international on solid-state circuits conference digest of technical papers (ISSCC) (pp. 226–227). doi:10.1109/ISSCC.2014.6757411 . 3.Ayazi, F., Tabrizian, R., Sorenson, L. (2012). Compensation, tuning, and trimming of MEMS resonators. In 2012 IEEE International in frequency control symposium (FCS) (pp. 1–7). doi:10.1109/FCS.2012.6243717 . 4.Van Beek, J.T.M., Puers, R. (2012). A review of MEMS oscillators for frequency reference and timing applications. Journal of Micromechanics and Microengineering 22(1), pp. 013,001. doi:10.1088/0960-1317/22/1/013001 . http://iopscience.iop.org/0960-1317/22/1/013001 . 5.Bourgeois, C., Steinsland, E., Blanc, N., de Rooij, N. (1997). Design of resonators for the determination of the temperature coefficients of elastic constants of monocrystalline silicon. In Proceedings of the 1997 IEEE international frequency control symposium, 1997 (pp. 791–799). doi:10.1109/FREQ.1997.639192 . 6.Casset, F., Durand, C., Civet, Y., Ollier, E., Carpentier, J., Ancey, P., Robert, P. (2010). MEMS resonator temperature compensation. In 2010 11th international conference on thermal, mechanical & multi-physics simulation, and experiments in microelectronics and microsystems (EuroSimE) (pp. 1–5). doi:10.1109/ESIME.2010.5464619 7.Chekurov, N., Aaltonen, L., Gronicz, J., Kosunen, M., Tittonen, I. (2010). Design and fabrication of a tuning fork shaped voltage controlled resonator with additional tuning electrodes for low-voltage applications. In Proceedings of eurosensors XXIV. 8.Chekurov, N., Grigoras, K., Sainiemi, L., Peltonen, A., Tittonen, I., Franssila, S. (2010). Dry fabrication of microdevices by the combination of focused ion beam and cryogenic deep reactive ion etching. Journal of Micromechanics and Microengineering 20(8), pp. 085,009. http://stacks.iop.org/0960-1317/20/i=8/a=085009 9.Gronicz, J., Chekurov, N., Kosunen, M., Tittonen, I. (2013). Design and fabrication of a tuning fork shaped voltage controlled resonator for low-voltage applications with additional tuning electrodes. Journal of Micromechanics and Microengineering 23(11), 115,004 (2013). 10.1088/0960-1317/23/11/115004 . http://iopscience.iop.org/0960-1317/23/11/115004 10.Gronicz, J., Pulkkinen, M., Yücetas, M., Halonen, K. (2014). A 2 \({\rm {\mu}}\) A temperature compensated MEMS-based real time clock with \(\pm\) 4 ppm timekeeping accuracy. In 2014 IEEE international symposium on circuits and systems (ISCAS) (pp. 514–517). doi:10.1109/ISCAS.2014.6865185 . 11.Hall, J. J. (1967). Electronic effects in the elastic constants of \(n\) -type silicon. Physical Review, 161(3), 756–761. doi:10.1103/PhysRev.161.756 .CrossRef 12.Hopcroft, M., Nix, W., & Kenny, T. (2010). What is the Young’s modulus of silicon? Journal of Microelectromechanical Systems, 19(2), 229–238. doi:10.1109/JMEMS.2009.2039697 .CrossRef 13.Hsu, W.T. (2008). Resonator miniaturization for oscillators. In 2008 IEEE international frequency control symposium (pp. 392–395). doi:10.1109/FREQ.2008.4623026 . 14.Kaajakari, V., Mattila, T., Oja, A., Kiihamaki, J., & Seppa, H. (2004). Square-extensional mode single-crystal silicon micromechanical resonator for low-phase-noise oscillator applications. Electron Device Letters, IEEE, 25(4), 173–175. doi:10.1109/LED.2004.824840 .CrossRef 15.Melamud, R., Chandorkar, S. A., Kim, B., Lee, H. K., Salvia, J., Bahl, G., et al. (2009). Temperature-insensitive composite micromechanical resonators. Journal of Microelectromechanical Systems, 18(6), 1409–1419. doi:10.1109/JMEMS.2009.2030074 .CrossRef 16.Partridge, A., Lee, H. C., Hagelin, P., Menon, V. (2013). We know that MEMS is replacing quartz. But why? And why now? In European frequency and time forum international frequency control symposium (EFTF/IFC), 2013 Joint (pp. 411–416). doi:10.1109/EFTF-IFC.2013.6702311 . 17.Pensala, T., Jaakkola, A., Prunnila, M., Dekker, J. (2011). Temperature compensation of silicon MEMS resonators by heavy doping. In 2011 IEEE International on ultrasonics symposium (IUS) (pp. 1952–1955). doi:10.1109/ULTSYM.2011.0486 . 18.Speeti, T., Aaltonen, L., Halonen, K. (2009). Integrated charge-pump phase-locked loop with SC-loop filter for capacitive microsensor readout. In IEEE international symposium on circuits and systems, 2009 (pp. 1373–1376). ISCAS 2009. doi:10.1109/ISCAS.2009.5118020 . 19.Sundaresan, K., Ho, G., Pourkamali, S., & Ayazi, F. (2007). Electronically temperature compensated silicon bulk acoustic resonator reference oscillators. IEEE Journal of Solid-State Circuits, 42(6), 1425–1434. doi:10.1109/JSSC.2007.896521 .CrossRef 20.Zadeh, S., Saha, T., Allidina, K., Nabki, F., El-Gamal, M. (2010). Electronic temperature compensation of clamped–clamped beam MEMS resonators. In 2010 53rd IEEE international midwest symposium on circuits and systems (MWSCAS) (pp. 1193–1196). doi:10.1109/MWSCAS.2010.5548878 .
作者单位:Jakub Gronicz (1) (2) Lasse Aaltonen (1) (3) Nikolai Chekurov (1) (4) Kari Halonen (1)
1. SMARAD-2, Department of Micro and Nanosciences, School of Electrical Engineering, Aalto University, Otakaari 5A, PO. Box 13000, Espoo, 02150, Finland 2. ICsense NV, Leuven, Belgium 3. Murata Electronics Oy, Vantaa, Finland 4. Oxford Instruments Analytical, Espoo, Finland
刊物类别:Engineering
刊物主题:Circuits and Systems Electronic and Computer Engineering Signal,Image and Speech Processing
出版者:Springer Netherlands
ISSN:1573-1979
文摘
This paper describes the design and measurement of a dual Phase-Locked Loop system that utilizes a MEMS VCO with a DC-controlled silicon resonator as the frequency-setting element. System-level considerations are given for the use of such structure in temperature compensation system for MEMS reference oscillators. Micromachining process and circuit design challenges of the particular implementation are also discussed. The PLL has been implemented using a 0.35 μm CMOS process and operates with a nominal supply of 3 V. The nominal supply voltage for the MEMS VCO is 24 V with 15 V bias applied to the silicon resonator. Keywords MEMS resonator PLL TCF Tuning fork