Fabrication and test of an electromagnetic vibrating ring gyroscope based on SOI wafer

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• 作者：Jili Liu (1)
  Deyong Chen (1) (2)
  Junbo Wang (1)
  
• 关键词：Vibrating ring gyroscope ; Mode matching ; Silicon ; On ; Insulator (SOI) ; TP212.1 ; U666.12+3
• 刊名：Journal of Electronics (China)
• 出版年：2014
• 出版时间：April 2014
• 年：2014
• 卷：31
• 期：2
• 页码：168-173
• 全文大小：412 KB
• 参考文献：1. Kai Liu, Weiping Zhang, Wenyuan Chen, / et al.. The development of micro-gyroscope technology. / Journal of Micromechanics and Microengineering, 19(2009)11, doi:10.1088/0960-1317/19/11/113001.
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  8. Jili Liu, Deyong Chen, and Junbo Wang. Regulating parameters of electromagnetic micro-machined vibrating ring gyroscope by feedback control. / Micro & Nano Letters, 7(2012)12, 1234鈥?236. 10.1049/mnl.2012.0550" target="_blank" title="It opens in new window">CrossRef
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• 作者单位：Jili Liu (1)
  Deyong Chen (1) (2)
  Junbo Wang (1)
  
  1. State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing, 100190, China
  2. No. 19, North 4th Ring Road West, Haidian District, Beijing, 100190, China
  
• ISSN：1993-0615

文摘

Mode matching is the key to improve the performance of micro-machined vibrating ring gyroscopes. Mass and stiffness asymmetries can lend to normal modes badly mismatch for gyroscopes fabricated by single-crystal silicon. The mismatch of the normal nodes results in large normal mode frequency split and degraded sensitivity. To address this issue, a Silicon-On-Insulator (SOI) wafer is used to fabricate the sensor chips. Meanwhile, a compensate disk and the backside coated negative photo resist (AZ303) is employed to weaken the Lag and Footing effect during the Deep Reactive Ion Etching (DRIE) process. Test results reveal that frequency split between the normal modes is of less than 10 Hz before the following electronic tuning. Thus, the mode matching of the electromagnetic vibrating ring gyroscope is probable to be realized.