Wettability optimization analysis of lead-free solders with Taguchi method
详细信息 查看全文
- 作者：Liang Zhang (1) (2)
Lei Sun (1)
Ji-guang Han (1)
Yong-huan Guo (1)
1. School of Mechanical and Electrical Engineering ; Jiangsu Normal University ; Xuzhou ; 221116 ; China
2. Department of Materials Science and Engineering ; University of California ; Los Angeles ; CA ; 90095 ; USA - 刊名：Journal of Materials Science: Materials in Electronics
- 出版年：2015
- 出版时间：April 2015
- 年：2015
- 卷：26
- 期：4
- 页码：2605-2608
- 全文大小：244 KB
- 参考文献：1. Suganuma, K, Niihara, K, Shoutoku, T, Nakamura, Y (1998) Wetting and interface microstructure between Sn-Zn binary alloys and Cu[J]. J. Mater. Res. 13: pp. 2859-2865 CrossRef
2. Zhang, L, Tu, KN (2014) Structure and properties of lead-free solders bearing micro and nano particles[J]. Mater Sci Eng R Rep 82: pp. 1-32 CrossRef
3. Suganuma, K (2001) Advances in lead-free electronics soldering[J]. Curr. Opin. Solid State Mater. Sci. 5: pp. 55-64 CrossRef
4. Zhang, L, Cui, JH, Han, JG, He, CW, Guo, YH, Yuan, JM (2014) Finite element analysis of SnAgCu (Zn Co, Fe) lead-free solder joints for electronic packaging[J]. Int. J. Nonlinear Sci. Numer. Simul. 15: pp. 197-206
5. Zhang, L, Han, JG, Guo, YH, He, CW (2014) Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments[J]. Mater. Sci. Eng. A 597: pp. 219-224 CrossRef
6. Ho, CY, Duh, JG (2013) Wetting kinetics and wettability enhancement of Pad added electrolytic Ni surface with molten Sn-3.0Ag-0.5Cu solder[J]. Mater. Lett. 92: pp. 278-280 CrossRef
7. Wu, CML, Yu, DQ, Law, CMT, Wang, L (2004) Properties of lead-free solder alloys with rare earth element additions[J]. Mater. Sci. Eng. R Rep. 44: pp. 1-44 CrossRef
8. Zhang, L, He, CW, Guo, YH, Han, JG, Zhang, YW, Wang, XY (2012) Development of SnAg-based lead-free solders in electronics packaging[J]. Microelectron. Reliab. 52: pp. 559-578 CrossRef
9. Zhang, L, Xue, SB, Gao, LL, Zeng, G, Sheng, Z, Chen, Y, Yu, SL (2009) Effects of rare earths on properties and microstructures of lead-free solder alloys[J]. J. Mater. Sci. Mater. Electron. 20: pp. 685-694 CrossRef
10. Gao, LL, Xue, SB, Zhang, L, Sheng, Z, Zeng, G, Ji, F (2010) Effects of trace rare earth Nd addition on microstructure and properties of SnAgCu solder[J]. J. Mater. Sci. Mater. Electron. 21: pp. 643-648 CrossRef
11. Shi, YW, Tian, J, Hao, H, Xia, ZD, Lei, YP, Guo, F (2008) Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder[J]. J. Alloys Compd. 453: pp. 180-184 CrossRef
12. Zhang, L, Fan, XY, Guo, YH, He, CW (2014) Properties enhancement of SnAgCu solders containing rare earth Yb[J]. Mater. Des. 57: pp. 646-651 CrossRef
13. Lau, CS, Abdullah, MZ, Ani, FC (2012) Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method[J]. Microelectron. Reliab. 52: pp. 1143-1152 CrossRef
14. Wu W., Qin F., Gao C., Zhu W.H. Thermal fatigue life optimization of QFN package based on Taguchi methods[C].13th International conference on electronic packaging technology and high density packaging, pp. 1128鈥?132 2012
15. Zhang, L, Sun, L, Han, JG, Guo, YH (2014) Reliability of lead-free solder joints in WLCSP device with finite element simulation and Taguchi method[J]. Int. J. Nonlinear Sci. Numer. Simul. 15: pp. 405-410 CrossRef
16. Li, MHC, Hong, SM (2005) Optimal parameter design for chip-on-film technology using the Taguchi method[J]. Int. J. Adv. Manuf. Technol. 25: pp. 145-153 CrossRef
17. Jong, WR, Tsai, HC, Chang, HT, Peng, SH (2008) The effects of temperature cyclic loading on lead-free solder joints of wafer level chip scale package by Taguchi method[J]. J. Electron. Packag. 130: pp. 011001 CrossRef
18. Mertol, A (1995) Application of the Taguchi method on the robust design of molded 225 plastic ball grid array packages[J]. IEEE Trans. Compon. Packag. Manuf. Technol. 18: pp. 734-743 CrossRef
19. Cheng, FJ, Gao, F, Zhang, JY, Jin, WS, Xiao, X (2011) Tensile properties and wettability of SAC0307 and SAC105 low Ag lead-free solder alloys[J]. J. Mater. Sci. 46: pp. 3424-3429 CrossRef
20. Wang, H, Xue, SB, Chen, WX, Wang, JX (2008) Effects of different fluxes on the characteristics of Sn-Zn solders[J]. Trans. China Weld. Inst. 30: pp. 5-8
21. Wang, JX, Xue, SB, Han, ZJ, Wang, N, Yu, SL (2006) Effects of temperature and coatings on wettability of Sn-Cu-Ni lead-free solder[J]. Trans. China Weld. Inst. 27: pp. 53-56
22. Wang, JX, Xue, SB, Fang, DS, Ju, JL, Han, ZJ, Yao, LH (2006) Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad[J]. Trans. Nonferrous Met. Soc. China 16: pp. 1374-1378 CrossRef
23. Zhang, L, Han, JG, He, CW, Guo, YH (2012) Microstructures and properties of SnZn lead-free solder joints bearing La for electronic packaging[J]. IEEE Trans. Electron Devices 59: pp. 3269-3272 CrossRef - 刊物类别：Chemistry and Materials Science
- 刊物主题：Chemistry
Optical and Electronic Materials
Characterization and Evaluation Materials - 出版者：Springer New York
- ISSN：1573-482X
文摘
In this paper, the wettability of lead-free solders on substrates with fluxes was studied based on reflow process and Taguchi method. Effects of different control factors, including solder materials, fluxes, substrate materials and atmosphere on the wettability of the lead-free solder joints were examined and calculated. Moreover, the effect of rare earth Eu on the wetting of SnAgCu solder was investigated, the effect mechanism was analyzed too. The wettability optimal design in the lead-free solders system has the combination of the SnAgCu-0.04Eu solder, RMA flux, Au/Ni/Cu substrate, and vacuum atmosphere. Moreover, the flux is the most important factor among the control factors in the wettability system.