Improving Semiconductor Reliability with Advanced Engineering Methods in Test Program Development

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• 作者：Stefan Vock (1) (2)
  Omar Escalona (3)
  Colin Turner (3)
  
  1. Faculty of Computing and Engineering ; University of Ulster ; Shore Road ; Newtownabbey ; Co. ; Antrim ; BT37 0QB ; UK
  2. Infineon Technologies AG ; Am Campeon 1-12 ; 85579 ; Neubiberg ; Germany
  3. Engineering Research Institute ; School of Engineering ; University of Ulster ; Shore Road ; Newtownabbey ; Co. Antrim ; BT37 0QB ; UK
  
• 关键词：Accelerated life testing ; Reliability ; Semiconductor aging ; Test equipment ; Testing ; Time to market
• 刊名：Journal of Electronic Testing
• 出版年：2015
• 出版时间：February 2015
• 年：2015
• 卷：31
• 期：1
• 页码：107-117
• 全文大小：2,506 KB
• 参考文献：1. Chen, X, Wang, Y, Cao, Y, Ma, Y, Yang, H (2012) Variation-aware supply voltage assignment for simultaneous power and aging optimization. IEEE Trans Very Large Scale Integration (VLSI) Syst 20: pp. 2143-2147 2168433" target="_blank" title="It opens in new window">CrossRef
  2. Han, S, Kim, B-S, Kim, J (2013) Variation-aware aging analysis in digital ICs. IEEE Trans Very Large Scale Integration (VLSI) Syst 21: pp. 2214-2225 CrossRef
  3. Infineon Technologies AG (2014) Company home webpage, viewed June 2014, <http://www.infineon.com/cms/en/product/index.html>
  4. ITRS (2013) International Technology Roadmap for Semiconductors 2013 Edition, viewed June 2014, <http://public.itrs.net/>
  5. Jeng, S-L, Huang, B-Y, Meeker, WQ (2011) Accelerated destructive degradation tests robust to distribution misspecification. IEEE Trans Reliab 60: pp. 701-711 2161051" target="_blank" title="It opens in new window">CrossRef
  6. Journal of Electronic Testing (2012) Special Issue on Testing of Three-Dimensional Stacked Integrated Circuits, 28(1)
  7. Meeker WQ (2010) Trends in the Statistical Assessment of Reliability, in Advances in Degradation Modeling, Statistics for Industry and Technology. In: Nikulin MS et al (ed) Springer
  8. Nahar A, Butler KM, Carulli JM, Weinberger, C (2009) Quality improvement and cost reduction using statistical outlier methods, Proc. IEEE International Conference on Computer Design, pp. 64鈥?9
  9. Nourivand, A, Al-Khalili, AJ, Savaria, Y (2012) Postsilicon tuning of standby supply voltage in SRAMs to reduce yield losses Due to parametric data-retention failures. IEEE Trans Very Large Scale Integration (VLSI) Syst 20: pp. 29-41 CrossRef
  10. Suhir, E (2013) Could electronics reliability be predicted, quantified and assured?. Microelectron Reliab 53: pp. 925-936 CrossRef
  11. Vock, S, Escalona, O, Turner, C, Owens, F (2012) Challenges for semiconductor test engineering: a review paper. J Electron Test Theory Appl 28: pp. 365-374 CrossRef
  12. Vock, S, Escalona, O, Turner, C, Owens, F (2014) The Use of software engineering methods for efficacious test program creation: a supportive evidence based case study. J Electron Test Theory Appl.
  13. Vock S, Escalona OJ, Owens FJ (2010) Commercial Challenges and Quality Robustness Issue in Semiconductor Manufacture Test and Measurement, Proc. 27th International Manufacturing Conference, Galway Institute of Technology, < http://eprints.ulster.ac.uk>
  
• 刊物类别：Engineering
• 刊物主题：Circuits and Systems
  Electronic and Computer Engineering
  Computer-Aided Engineering and Design
  
• 出版者：Springer Netherlands
• ISSN：1573-0727

文摘

Advancing semiconductor technology in combination with new assembly and packaging technologies are unfolding a new level of challenges for production testing. Reliability of semiconductors should be ensured by applying dedicated techniques within production testing addressing various aging aspects such as: device wear-out related degradation or reduced operational voltage headroom. Thus, test program quality is emerging as a major concern, as it is directly translating into microelectronics reliability and devices quality. With the heightened sensitivity of semiconductor technology to smallest deviations in test methods from the allowed operational range, the risk of accidentally degrading the integrated circuits reliability increases significant. In this paper we propose an approach that addresses the demand for improving semiconductor technology reliability production tests quality. The presented industry usage based case studies, in combination with described techniques, provide a set of valuable practical guidelines.