Electromigration of composite Sn-Ag-Cu solder bumps

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• 作者：Ashutosh Sharma ; Di Erick Xu ; Jasper Chow ; Michael Mayer…
• 关键词：Sn ; Ag ; Cu ; lead ; free solder ; composite solder ; direct current aging
• 刊名：Electronic Materials Letters
• 出版年：2015
• 出版时间：November 2015
• 年：2015
• 卷：11
• 期：6
• 页码：1072-1077
• 全文大小：1,880 KB
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• 作者单位：Ashutosh Sharma (1)
  Di Erick Xu (2)
  Jasper Chow (2)
  Michael Mayer (2)
  Heung-Rak Sohn (3)
  Jae Pil Jung (1)
  
  1. Microjoining and Semiconductor Packaging Lab, Department of Materials Science and Engineering, University of Seoul, Seoul, 130-743, Korea
  2. Microjoining Laboratory, Centre for Advanced Materials Joining, Department of Mechanical and Mechatronics Engineering, University of Waterloo, Waterloo, Ontario, Canada, N2L3G1
  3. KD One Co., Ltd., Gukhoidae-ro 76 gil 22 (Yeouido-dong), Yeongdeungpo-gu, Seoul, 150-729, Korea
  
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Condensed Matter Physics
  Electronics, Microelectronics and Instrumentation
  Optical and Electronic Materials
  Thermodynamics
  Characterization and Evaluation of Materials
  
• 出版者：The Korean Institute of Metals and Materials, co-published with Springer Netherlands
• ISSN：2093-6788

文摘

This study investigates the electromigration (EM) behavior of lead free Sn-Ag-Cu (SAC) solder alloys that were reinforced with different types of nanoparticles [Copper-coated carbon nanotubes (Cu/CNT), La₂O₃, Graphene, SiC, and ZrO₂]. The composite solders were bumped on a Cu substrate at 220°C, and the resistance of the bumped solders was measured using a four wire setup. Current aging was carried out for 4 hours at a temperature of 160°C, and an increase in resistance was noted during this time. Of all the composite solders that were studied, La₂O₃ and SiC reinforced SAC solders exhibited the smallest resistances after current aging. However, the rate of change in the resistance at room temperature was lower for the SiC-reinforced SAC solder. The SAC and Graphene reinforced SAC solder bumps completely failed within 15 - 20 min of these tests. The SiC nanoparticles were reported to possibly entrap the SAC atoms better than other nanoparticles with a lower rate of EM.