Sn-Ag-Cu to Cu joint current aging test and evolution of resistance and microstructure

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• 作者：Di Erick Xu ; Jasper Chow ; Michael Mayer ; Jae Pil Jung…
• 关键词：Sn ; Ag ; Cu solder ; electromigration ; four wire method ; electrical current aging ; in situ monitoring
• 刊名：Electronic Materials Letters
• 出版年：2015
• 出版时间：November 2015
• 年：2015
• 卷：11
• 期：6
• 页码：1078-1084
• 全文大小：2,267 KB
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• 作者单位：Di Erick Xu (1)
  Jasper Chow (1)
  Michael Mayer (1)
  Jae Pil Jung (2)
  Jong Hyun Yoon (3)
  
  1. Microjoining Laboratory, Centre for Advanced Materials Joining, Department of Mechanical and Mechatronics Engineering, University of Waterloo, Waterloo, ON, N2L3G1, Canada
  2. Microjoining and Semiconductor Packaging Lab, Department of Materials Science and Engineering, University of Seoul, 90 JunNong-dong, DongDaeMun-gu, Seoul, 130-743, Korea
  3. KDone Co. Ltd., 19-5, Baeksukpo-Ri, Asan, Chungcheongnam-Do, 336-821, Korea
  
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Condensed Matter Physics
  Electronics, Microelectronics and Instrumentation
  Optical and Electronic Materials
  Thermodynamics
  Characterization and Evaluation of Materials
  
• 出版者：The Korean Institute of Metals and Materials, co-published with Springer Netherlands
• ISSN：2093-6788

文摘

SAC 305 solder bump with 800 μm diameter were produced and soldered to a custom substrate with Cu lines as leads that allow for resistance measurement during current aging. The measured joint resistance values (leads plus solder bump) before aging are 7.7 ± 1.8 mΩ and 11.8 ± 2.8 mΩ at room temperature and 160°C, respectively. In general, the resistance of the solder joint increases instantly by about 1 mΩ, when subjected to a 2.2 A aging current at 160°C. The increase is gradual in the following hours of aging and more drastic as it approaches the final failure. Four stages are identified in the resistance signal curve and compared with observations from cross sections. The stages are IMC growth, crack formation and propagation, intermittent crack healing-forming, and final failure resulting in an open connection at the cathode. Recently a periodical drop and rise behavior was reported for the resistance signal. This behavior is reproduced and attributed to the intermittent crack healing-forming stage. The healing events observed are faster than the sampling time. Possibly, as current is concentrated when bypassing interfacial cracks, local melting occurs partially filling cracks before resolidifying.