Soy-substituted liquid phenol formaldehyde binders for flakeboard

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• 作者：William Hand ; George Cheng ; Brian Via…
• 刊名：European Journal of Wood and Wood Products
• 出版年：2017
• 出版时间：January 2017
• 年：2017
• 卷：75
• 期：1
• 页码：135-138
• 全文大小：
• 刊物类别：Biomedical and Life Sciences
• 刊物主题：Wood Science & Technology; Ceramics, Glass, Composites, Natural Materials; Operating Procedures, Materials Treatment;
• 出版者：Springer Berlin Heidelberg
• ISSN：1436-736X
• 卷排序：75

文摘

The degree to which liquid phenol formaldehyde resin for flakeboard applications can be replaced by soy flour was studied through a design of experiment approach. Up to ten percent substitution could be achieved while substantially maintaining board properties. Higher levels of substitution increased the viscosity of the resin droplet, which reduced resin spread and various strength properties. The loss of strength was most apparent for dense boards where the spreading limitation reduced the relative bonded area.