Signal analysis of CMP process based on AE monitoring system

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• 作者：Sun-Joon Park ; Hyun-Seop Lee ; Haedo Jeong
• 关键词：Chemical mechanical planarization(CMP) ; Acoustic emission(AE) sensor ; Fast fourier transform(FFT)
• 刊名：International Journal of Precision Engineering and Manufacturing-Green Technology
• 出版年：2015
• 出版时间：January 2015
• 年：2015
• 卷：2
• 期：1
• 页码：15-19
• 全文大小：362KB
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• 作者单位：Sun-Joon Park (1)
  Hyun-Seop Lee (2)
  Haedo Jeong (1)
  
  1. School of Mechanical Engineering, Pusan National University, 2, Busandaehak-ro 63beon-gil, Geumjeong-gu, Busan, South Korea, 609-836
  2. Department of Mechanical Engineering, Tongmyong University, 428, Sinseon-ro, Nam-gu, Busan, South Korea, 608-711
  
• 刊物类别：Industrial and Production Engineering; Energy Efficiency (incl. Buildings); Sustainable Development;
• 刊物主题：Industrial and Production Engineering; Energy Efficiency (incl. Buildings); Sustainable Development;
• 出版者：Korean Society for Precision Engineering
• ISSN：2198-0810

文摘

As chemical mechanical planarization (CMP) enables local and global planarization over a wafer surface by the combined effects of chemical and mechanical interactions, process monitoring is becoming an increasingly important in-situ methodology for process control. According to the materials and process, signal characteristics were distinguishable between material and process. In this study, an acoustic emission (AE) sensor was used to measure the abrasive and molecular-scale phenomena during CMP. An AE signal was acquired using rotational equipment and adapted to two types of equipment. First, a wireless AE system consisting of wireless modules using Bluetooth was used. This system was suitable for acquiring signals in rotational equipment. However, a wireless AE system could be acquired with only Root Mean Square(RMS) signals. Second, mercury slip-ring (wired) AE systems that were suitable for rotational equipment and the acquisition of raw signals were used. The acquired raw signals could be analyzed by a Fast Fourier Transform (FFT) for abrasive and molecular-level phenomena in the CMP process. The AE signal parameters including the AE RMS, frequency, and amplitude were analyzed for abrasive and molecular-level phenomena in the CMP process. The authors analyzed the AE signals for changes in the materials and CMP process. Keywords Chemical mechanical planarization(CMP) Acoustic emission(AE) sensor Fast fourier transform(FFT)