Heat Flow Pattern and Thermal Resistance Modeling of Anisotropic Heat Spreaders

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• 作者：F. Falakzaadeh ; R. Mehryar
• 关键词：Anisotropic heat spreaders ; spreading thickness ; thermal resistance
• 刊名：Journal of Electronic Materials
• 出版年：2017
• 出版时间：January 2017
• 年：2017
• 卷：46
• 期：1
• 页码：64-72
• 全文大小：
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Optical and Electronic Materials; Characterization and Evaluation of Materials; Electronics and Microelectronics, Instrumentation; Solid State Physics;
• 出版者：Springer US
• ISSN：1543-186X
• 卷排序：46

文摘

To ensure safe operating temperatures of the ever smaller heat generating electronic devices, drastic measures should be taken. Heat spreaders are used to increase surface area, by spreading the heat without necessarily transferring it to the ambient in the first place. The heat flow pattern is investigated in heat spreaders and the fundamental differences regarding how heat conducts in different materials is addressed. Isotropic materials are compared with anisotropic ones having a specifically higher in-plane thermal conductivity than through plane direction. Thermal resistance models are proposed for anisotropic and isotropic heat spreaders in compliance with the order of magnitude of dimensions used in electronics packaging. After establishing thermal resistance models for both the isotropic and anisotropic cases, numerical results are used to find a correlation for predicting thermal resistance in anisotropic heat spreaders with high anisotropy ratios.