Hygro-thermo-mechanical Behavior of Adhesive-Based Flexible Chip-on-Flex Packaging

详细信息    查看全文

• 作者：Hsien-Chie Cheng ; Ho-Hsiang Huang ; Wen-Hwa Chen…
• 关键词：Chip ; on ; flex ; anisotropic conductive adhesive (ACA) ; finite element modeling ; transient moisture diffusion ; hygro ; thermo ; mechanical analysis ; hygro ; thermal aging
• 刊名：Journal of Electronic Materials
• 出版年：2015
• 出版时间：April 2015
• 年：2015
• 卷：44
• 期：4
• 页码：1220-1237
• 全文大小：1,794 KB
• 参考文献：1. Mao, D, Quevedo-Lopez, MA, Alshareef, HN, Stiegler, H, Gnade, BE (2010) Org. Electron. 11: pp. 925 CrossRef
  2. Hong, YT, He, ZQ, Lennhoff, NS, Banach, DA, Kanicki, J (2004) J. Electron. Mater. 33: pp. 312 CrossRef
  3. K. Chen, R. Zenner, M. Arneson, and D. Mountain, Ultra-thin electronic device package, in IEEE Electronic Components and Technology Conference, 1999, pp. 657-62.
  4. Yim, MJ, Hwang, J-S, Kim, JG, Ahn, JY, Kim, HJ, Kwon, W, Paik, K-W (2004) J. Electron. Mater. 33: pp. 76 CrossRef
  5. Cheng, H-C, Ho, C-L, Chen, W-C, Yang, S-S (2006) IEEE Trans. Compon. Packag. Technol. 29: pp. 577 CrossRef
  6. Wong, EH, Rajoo, R, Koh, SW, Lim, TB (2002) J. Electron. Packag. 124: pp. 122 CrossRef
  7. Tsai, M-Y, Huang, C-Y, Chiang, C-Y, Chen, W-C, Yang, S-S (2007) IEEE Trans. Compon. Packag. Technol. 30: pp. 517 CrossRef
  8. Ikeda, T, Kim, W-K, Miyazaki, N (2006) IEEE Trans. Compon. Packag. Technol. 29: pp. 551 CrossRef
  9. Yoon, J-Y, Kim, I, Lee, S-B (2009) J. Electron. Packag. 131: pp. 021012-1 CrossRef
  10. W.H. Zhu, S.L. Gan, and C.L. Toh, Mechanical Properties of Molding Compounds (MCs) under Different Moisture Conditions and in a Wide Temperature Range, in 5th International Conference on Thermal and Mechanical Simulation and Experiments in Micro-electronics and Micro-Systems, 2004, pp. 593?98
  11. Lam, DCC, Wang, J (2007) J. Electron. Mater. 36: pp. 226 CrossRef
  12. I.L. Chen, / Correlation Between the Viscoelastic Properties of Anisotropic Conductive Adhesive and Reliability of Chip- / on- / Flex, Master Thesis, Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan, 2009. (in Chinese)
  13. Teh, LK, Teo, M, Anto, E, Wong, CC, Mhaisalkar, SG, Teo, PS, Wang, EH (2005) IEEE Trans. Compon. Packag. Technol. 28: pp. 506 CrossRef
  14. Tan, CW, Chiu, YW, Chan, YC (2003) Mater. Sci. Eng. B 98: pp. 255 CrossRef
  15. Chiang, KN, Chang, CW, Lin, JD (2001) J. Electron. Packag. 123: pp. 331 CrossRef
  16. Cheng, H-C, Ma, C-H, Yu, C-F, Lu, S-T, Chen, W-H (2013) Comput. Mater. Contin. 38: pp. 129
  17. Yoon, S, Han, B, Wang, Z (2007) J. Electron. Packag. 129: pp. 421 CrossRef
  18. Tsai, M-Y, Wu, CY, Huang, CY, Yang, SS (2008) IEEE Trans. Adv. Packag. 31: pp. 454 CrossRef
  19. Chen, KM, Wu, CY, Wang, CH, Cheng, H-C, Huang, NC (2014) J. Electron. Mater. 43: pp. 4229 CrossRef
  20. Shen, CH, Springer, GS (1976) J. Compos. Mater. 10: pp. 2 CrossRef
  21. Loos, AC, Springer, GS (1979) J. Compos. Mater. 13: pp. 131 CrossRef
  22. Wong, EH, Rajoo, R (2003) Microelectron. Reliab. 43: pp. 2087 CrossRef
  23. JIS K 7209, Testing Methods for Water and Boiling Water Absorption of Plastics. Japanese Standards Association, 1984.
  24. SEMI G66-96, Test Method for the Measurement of Wat
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Chemistry
  Optical and Electronic Materials
  Characterization and Evaluation Materials
  Electronics, Microelectronics and Instrumentation
  Solid State Physics and Spectroscopy
  
• 出版者：Springer Boston
• ISSN：1543-186X

文摘

Although adhesive-based chip-on-flex (COF) packaging technologies have many advantageous features, such as flexibility and compatibility with standard semiconductor and microelectronics packaging processes, the low hygro-thermal resistance leads to reliability concerns. Thus, finite element (FE) modeling and experimental testing have been used to investigate the effects of temperature and humidity conditions on the hygro-thermo-mechanical behavior of a thin flexible anisotropic conductive adhesive (ACA)-based COF packaging technology. The investigation starts from process modeling of the thermo-mechanical behavior of the technology during the ACA bonding process. The validity of the process modeling is demonstrated by temperature and warpage experiments. Furthermore, three-dimensional (3-D) transient moisture diffusion FE analysis through a thermal–moisture analogy based on the “wetness-technique is performed to evaluate the moisture distribution, in which the moisture properties of the polyimide (PI) substrate are obtained through a moisture absorption experiment. Then, the effect of the moisture properties of the ACA adhesive and PI substrate on the moisture diffusion behavior is examined. Finally, following process modeling, 3-D hygro-thermo-mechanical FE analysis under a constant temperature and humidity condition is undertaken to assess the influence of hygro-thermal aging and stress relaxation of the ACA adhesive on the long-term contact performance of the interconnects.