Effect of Ti Addition on Early-Stage Wetting Behavior Between Zn-25Sn-xTi Solder and Cu

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• 作者：Wei-Chih Huang ; Kwang-Lung Lin
• 关键词：Pb ; free solder ; incubation period ; intermetallic ; microstructure
• 刊名：Journal of Electronic Materials
• 出版年：2016
• 出版时间：December 2016
• 年：2016
• 卷：45
• 期：12
• 页码：6137-6142
• 全文大小：
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Optical and Electronic Materials; Characterization and Evaluation of Materials; Electronics and Microelectronics, Instrumentation; Solid State Physics;
• 出版者：Springer US
• ISSN：1543-186X
• 卷排序：45

文摘

This study explored the early-stage behavior of the wetting interaction between Zn-25Sn-(0 wt.% to 0.15 wt.%)Ti and Cu substrate using the wetting balance method. High-temperature Zn-25Sn-(0 wt.% to 0.15 wt.%)Ti solders were investigated at 435°C and liquid epoxy at ambient condition to compare reactive and nonreactive wetting, respectively. The wetting curves at the early stage, before the wetting time, exhibited a plateau region reflecting the incubation period for the reactive wetting system. Such an incubation period was not observed for the nonreactive, liquid epoxy system. Cu₅Zn₈ and CuZn₅ formed at the interface between the solder and Cu substrate in the early stage of wetting. The incubation period behavior was significantly affected by Ti addition. Ti gathered at the Cu–solder interface, thus affecting the reactive wetting behavior. The dipping temperature also affected the incubation period behavior and thus the final wetting performance. The results show that the occurrence of an incubation period was enhanced by higher reaction temperature.