3-dimensional circuit device fabrication process using stereolithography and direct writing

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• 作者：Sung Hyun Jang ; Sung Taek Oh ; In Hwan Lee…
• 关键词：Additive manufacturing ; Stereolithography ; Direct writing ; Photopolymer ; Conductive material
• 刊名：International Journal of Precision Engineering and Manufacturing
• 出版年：2015
• 出版时间：June 2015
• 年：2015
• 卷：16
• 期：7
• 页码：1361-1367
• 全文大小：2,012 KB
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• 作者单位：Sung Hyun Jang (1)
  Sung Taek Oh (2)
  In Hwan Lee (3)
  Ho-Chan Kim (4)
  Hae Yong Cho (3)
  
  1. Gumi Electronics and Information Technology Research Institute (GERI), 17, Cheomdangieop 1-ro, Sandong-myeon, Gumi-si, Gyeongsangbuk-do, 730-853, South Korea
  2. Department of Precision Mechanical Engineering, Chungbuk National University, 1, Chungdae-ro, Heungdeok-gu, Cheongju-si, Chungcheongbuk-do, 362-763, South Korea
  3. School of Mechanical Engineering, Chungbuk National University, 1, Chungdae-ro, Heungdeok-gu, Cheongju-si, Chungcheongbuk-do, 362-763, South Korea
  4. Department of Mechanical and Automotive Engineering, Andong National University, 1375, Gyeongdong-ro, Andong-si, Gyeongsangbuk-do, 760-749, South Korea
  
• 刊物类别：Engineering
• 刊物主题：Industrial and Production Engineering
  Materials Science
  
• 出版者：Korean Society for Precision Engineering, in co-publication with Springer Verlag GmbH
• ISSN：2005-4602

文摘

Additive manufacturing (AM) technology is a method to fabricate a 3-dimensional structure by stacking thin layers. Among AM technologies, it is known that stereolithography (SL) technology can fabricate a structure having high dimensional accuracy. Recently, this technology is being applied for real manufacturing. Meanwhile, direct writing (DW) technology has been used to apply a lowviscosity liquid material on a substrate. In this regards, in this research, we applied the DW technology to deposit a conductive material on the surface of a three-dimensional structure. Moreover, a three-dimensional circuit device (3DCD) which is different from conventional two-dimensional PCBs can be fabricated by the hybrid process of SL and DW technologies. An insulated structure of circuit board having high precision was fabricated using stereolithography. Furthermore, a circuit is fabricated on the several layers using DW. And the 3DCD sample that detects a light was fabricated, successfully.