A Hybrid Fault-Tolerant Architecture for Highly Reliable Processing Cores

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• 作者：I. Wali ; Arnaud Virazel ; A. Bosio ; P. Girard…
• 关键词：Fault tolerance ; Microprocessor ; Single event transient ; Permanent fault ; Delay fault ; Power consumption ; High dependability ; Fault injection
• 刊名：Journal of Electronic Testing
• 出版年：2016
• 出版时间：April 2016
• 年：2016
• 卷：32
• 期：2
• 页码：147-161
• 全文大小：1,542 KB
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• 作者单位：I. Wali (1)
  Arnaud Virazel (1)
  A. Bosio (1)
  P. Girard (1)
  S. Pravossoudovitch (1)
  M. Sonza Reorda (2)
  
  1. Laboratoire d’Informatique de Robotique et de Microélectronique de Montpellier, University of Montpellier / CNRS, 161 rue Ada, 34392, Cedex 5, Montpellier, France
  2. Politecnico di Torino, Torino, Italy
  
• 刊物类别：Engineering
• 刊物主题：Circuits and Systems
  Electronic and Computer Engineering
  Computer-Aided Engineering and Design
  
• 出版者：Springer Netherlands
• ISSN：1573-0727

文摘

Increasing vulnerability of transistors and interconnects due to scaling is continuously challenging the reliability of future microprocessors. Lifetime reliability is gaining attention over performance as a design factor even for lower-end commodity applications. In this work we present a low-power hybrid fault tolerant architecture for reliability improvement of pipelined microprocessors by protecting their combinational logic parts. The architecture can handle a broad spectrum of faults with little impact on performance by combining different types of redundancies. Moreover, it addresses the problem of error propagation in nonlinear pipelines and error detection in pipeline stages with memory interfaces. Our case-study implementation of a fault tolerant MIPS microprocessor highlights four main advantages of the proposed solution. It offers (i) 11.6 % power saving, (ii) improved transient error detection capability, (iii) lifetime reliability improvement, and (iv) more effective fault accumulation effect handling, in comparison with TMR architectures. We also present a gate-level fault-injection framework that offers high fidelity to model physical defects and transient faults.