Infrared Brazing of Ti₅₀Ni₅₀ Shape Memory Alloy and Inconel 600 Alloy with Two Ag-Cu-Ti Active Braze Alloys

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• 作者：Ren-Kae Shiue ; Shyi-Kaan Wu ; Sheng-Hao Yang
• 刊名：Metallurgical and Materials Transactions A
• 出版年：2017
• 出版时间：February 2017
• 年：2017
• 卷：48
• 期：2
• 页码：735-744
• 全文大小：
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Metallic Materials; Characterization and Evaluation of Materials; Structural Materials; Surfaces and Interfaces, Thin Films; Nanotechnology;
• 出版者：Springer US
• ISSN：1543-1940
• 卷排序：48

文摘

Infrared brazing of Ti₅₀Ni₅₀ SMA and Inconel 600 alloy using Cusil-ABA and Ticusil filler metals has been investigated. The joints were dominated by Ag-Cu eutectic with proeutectic Cu in the Cusil-ABA brazed joint and with proeutectic Ag in the Ticusil one. A continuous curved belt composed of a Ni₃Ti layer and a (Cu_xNi_1−x)₂Ti layer formed in the brazed Ti₅₀Ni₅₀/Ticusil/Inconel 600 joint. On the Ti₅₀Ni₅₀ SMA side, an intermetallic layer of (Cu_xNi_1−x)₂Ti formed in all joints, with x values around 0.81 and 0.47. Layers of (Cu_xNi_1−x)₂Ti, Ni₃Ti, and mixed Ni₃Ti and Ni₂Cr intermetallics were observed next to the Inconel 600 substrate in the brazed Ti₅₀Ni₅₀/Cusil-ABA/Inconel 600 joint. The maximum shear strengths of the joints using the Cusil-ABA filler metal and the Ticusil filler metal were 324 and 300 MPa, respectively. In the Cusil-ABA brazed joint, cracks with cleavage-dominated fracture propagated along the (Cu_xNi_1−x)₂Ti interfacial layer next to the Ti₅₀Ni₅₀ SMA substrate. In the Ticusil brazed joint, ductile dimple fracture occurred in the Ag-rich matrix near the Inconel 600 alloy substrate. The absence of a detrimental Ti-Fe-(Cu) layer on the Inconel 600 substrate side can effectively improve the shear strength of the joint.