Microstructures of hot-pressed Cr–Ti–Cu targets and their film properties for perpendicular magnetic recording application
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  • 作者:Kun-Ming Chen ; Yun-Kai Cheng ; Hsien-Lun Chao…
  • 刊名:Journal of Materials Science: Materials in Electronics
  • 出版年:2016
  • 出版时间:July 2016
  • 年:2016
  • 卷:27
  • 期:7
  • 页码:6881-6890
  • 全文大小:2,463 KB
  • 刊物类别:Chemistry and Materials Science
  • 刊物主题:Chemistry
    Optical and Electronic Materials
    Characterization and Evaluation Materials
  • 出版者:Springer New York
  • ISSN:1573-482X
  • 卷排序:27
文摘
In this study, the effect of Cr50−0.5xTi50−0.5xCux (x = 0, 10, 20, 30, 40, 50) hot-pressed target on film performance was investigated. By increasing the ratio of Cu, the target strength and anti crack properties showed significant improvements due to the decrease of brittle intermetallic compound. In addition, the target properties were found to affect the performance of sputtering process and its film. During sputtering test, the arcing behavior was significantly suppressed by reducing the incoherent defects of the target. The results of film analysis also showed the advantages with increasing Cu ratio in Cr–Ti–Cu alloy systems, including the decrease on sheet resistivity, intrinsic stress and surface roughness. Moreover, all as-deposited films were clarified as amorphous structures to meet the requirement for perpendicular recording media application, and further analyzed with Ω and δ indices, which were subjected to quasi-chemical energy and the atomic size difference, respectively. Unfortunately, the excessive Cu addition makes a side effect on the corrosion resistance in acid environment. Related results mentioned above were supported by bending strength measurement, X-ray diffraction, scanning electron microscope, atomic force microscope, Twyman–Green interferometer, and four-point probes method.

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