Transient Liquid Phase Diffusion Bonding of 6061Al-15 wt.% SiC _p Composite Using Mixed Cu-Ag Powder Interlayer

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• 作者：Pallab Roy ; Tapan Kumar Pal ; Joydeep Maity
• 关键词：eutectic phase mixture ; isothermal solidification ; joint strength ; particle segregation ; transient liquid phase diffusion bonding ; 6061 ; SiCp composite
• 刊名：Journal of Materials Engineering and Performance
• 出版年：2016
• 出版时间：August 2016
• 年：2016
• 卷：25
• 期：8
• 页码：3518-3530
• 全文大小：4,457 KB
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Chemistry
  Characterization and Evaluation Materials
  Materials Science
  Tribology, Corrosion and Coatings
  Quality Control, Reliability, Safety and Risk
  Engineering Design
  
• 出版者：Springer New York
• ISSN：1544-1024
• 卷排序：25

文摘

Microstructure and shear strength of transient liquid phase diffusion bonded (560 °C, 0.2 MPa) 6061Al-15 wt.% SiCp extruded composite using a 50-µm-thick mixed Cu-Ag powder interlayer have been investigated. During isothermal solidification that took 2 h for completion, a ternary liquid phase formed due to diffusion of Cu and Ag in Al. Subsequent cooling formed a ternary phase mixture (α-Al + CuAl₂ + Ag₂Al) upon eutectic solidification. With mixed Cu-Ag powder interlayer, isothermal solidification was faster than for pure Al joints made using a 50-µm-thick Cu foil interlayer and for the composite joints made using a 50-µm-thick Cu foil/powder interlayer under similar conditions. The presence of brittle eutectic phase mixture (CuAl₂ + Ag₂Al) led to poor joint strength at short TLP bonding times. The mixture disappeared upon isothermal solidification with a 2-h hold yielding improved joint strength even with solidification shrinkage in the joint. Increased holding time (6 h) erased shrinkage via solid state diffusion and yielded the highest joint strength (87 MPa) and fair joint efficiency (83%).