Prediction enhancement of the J-lead interconnection reliability of land grid array sockets

详细信息    查看全文

• 作者：Jinae Lee ; Hyung Wook Park
• 关键词：Finite element analysis ; Land grid array ; J ; lead interconnection ; Reliability ; Solder joint
• 刊名：Journal of Mechanical Science and Technology
• 出版年：2015
• 出版时间：May 2015
• 年：2015
• 卷：29
• 期：5
• 页码：2187-2193
• 全文大小：3,234 KB
• 参考文献：[1]R. R. Tummala, Fundamentals of Microsystems Packaging, McGraw-Hill, New York, USA (2001).
  [2]P. H. Hochstenbach, W. D. van Driel, D. G. Yang, J. J. M. Zaal and E. Bagerman, Designing for reliability using a new wafer level package structure, Microelectronics Reliability, 50 (4) (2010) 528-35.View Article
  [3]L. Sangil, Z. H. Min and F. B. Daniel, A numerical study of void nucleation and growth in a flip chip assembly process, Modelling and Simulation in Materials Science and Engineering, 18 (6) (2010) 065005.View Article
  [4]T.-W. Hui and G.-H. Pang, Solder paste inspection using region-based defect detection, International Journal of Advanced Manufacturing Technology, 42 (7-) (2009) 725-34.View Article
  [5]A. Saenthon and S. Kaitwanidvilai, Development of new edge-detection filter based on genetic algorithm: An application to a soldering joint inspection, International Journal of Advanced Manufacturing Technology, 46 (9-2) (2010) 1009-019.View Article
  [6]J. Lau, S. Pan and C. Chang, Nonlinear fracture mechanics analysis of wafer level chip scale package solder joints with cracks, International Journal of Microcircuits and Electronic Packaging, 24 (2001) 1-.
  [7]C.-C. Lee, K.-C. Chang and Y.-W. Yang, Lead-free solder joint reliability estimation of flip chip package using fembased sensitivity analysis, Soldering & Surface Mount Technology, 21 (1) (2009) 31-1.View Article
  [8]R. S. Chen, S. C. Tseng and C. S. Wan, Effects of solder joint structure and shape on thermal reliability of plastic ball grid array package, International Journal of Advanced Manufacturing Technology, 27 (7) (2006) 677-87.View Article
  [9]S. Tseng, R. Chen and C. Lio, Stress analysis of lead-free solders with under bump metallurgy in a wafer level chip scale package, International Journal of Advanced Manufacturing Technology, 31 (1) (2006) 1-.View Article
  [10]Z. Li, Y. Kang, J.-H. Moon and H. Pahk, The optimum projection angle of fringe projection for ball grid array inspection based on reflectance analysis, International Journal of Advanced Manufacturing Technology, 67 (5-) (2013) 1597-607.View Article
  [11]C. Xiangyang and D. Zhou, Modeling and reliability analysis of lead-free solder joints of bottom leaded plastic (BLP) package, 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, Shanghai, China (2006) 274-53.
  [12]T. Y. Tee and Z. Zhong, Board level solder joint reliabilityanalysis and optimization of pyramidal stacked die bga packages, Microelectronics Reliability, 44 (12) (2004) 1957-965.View Article
  [13]Y.-S. Lai and T. H. Wang, Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages, Microelectronics and Reliability, 47 (1) (2007) 104-10.View Article
  [14]R. Darveaux, Effect of simulation methodology on solder joint crack growth correlation and fatigue life prediction, Journal of Electronic Packaging, 124 (3) (2002) 147-54.View Article
  [15]A. Batra, P. Ramachandran, P. Sathyanarayanan, S. Lu and H. Srihari, Reliability enhancement of electronic packages by design of optimal parameters, Microelectronics and Reliability, 44 (7) (2004) 1157-163.View Article
  [16]H. W. Park and S. Y. Liang, Force modeling of microscale grinding process incorporating thermal effects, International Journal of Advanced Manufacturing Technology, 44 (5-) (2009) 476-86.View Article
  [17]D. T. Rooney, N. T. Castello, M. Cibulsky, D. Abbott and D. Xie, Materials characterization of the effect of mechanical bending on area array package interconnects, Microelectronics Reliability, 44 (2) (2004) 275-85.View Article
  [18]T. Y. Tee, H. S. Ng, Z. Zhong and J. Zhou, Board-level solder joint reliability analysis of thermally enhanced BGAS and LGAS, IEEE Transactions on advanced Packaging, 29 (2) (2006) 284-90.View Article
  [19]B. Rodgers, B. Flood, J. Punch and F. Waldron, Experimental determination and finite element model validation of the anand viscoplasticity model constants for SnAgCu, 6th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Berlin, Germany (2005) 490-96.
  
• 作者单位：Jinae Lee (1)
  Hyung Wook Park (2)
  
  1. College of Medicine, Yonsei University, 50 Yonsei-Ro, Seodaemun-gu, Seoul, 120-752, Korea
  2. Department of Mechanical Engineering, Ulsan National Institute of Science and Technology, UNIST-gil 50, Ulsan, 689-798, Korea
  
• 刊物类别：Engineering
• 刊物主题：Mechanical Engineering
  Structural Mechanics
  Control Engineering
  Industrial and Production Engineering
  
• 出版者：The Korean Society of Mechanical Engineers
• ISSN：1976-3824

文摘

The solder joint is a key component in land grid array (LGA) sockets. A simplified solder joint has been widely used in finite element model (FEM) computations because the J-lead interconnection solder joint is relatively complex. Therefore, there are discrepancies between the physical phenomenon and FEM simulations. In this study, an alternative method to simulate the J-lead interconnection solder joint through an interface program using surface evolver software is presented. Simulations of the J-lead interconnection solder joint were improved to reduce the mismatch between the actual physical shape and the simplified finite element models that are typically used to predict component reliability. To perform these simulations, an interface program capable of simulating solder interconnections for twelve different pad–solder combinations was developed. Predictions of J-lead interconnection solder joints were carried out using the interface program. Geometric comparisons between experimental data and predictions showed good agreement, with the exception of wetting height. To evaluate the prediction accuracy of the simulated J-lead solder joints, FEM analysis was performed for the static load and the thermal cycle.