Structural Aspects of the Behavior of Lead-Free Solder in the Corrosive Solution

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• 作者：K. Pietrzak (1) krystyna.pietrzak@its.waw.pl
  M. Grobelny (1)
  K. Makowska (1)
  N. Sobczak (1)
  D. Rudnik (1)
  A. Wojciechowski (1)
  E. Sienicki (1)
• 关键词：corrosion resistance – ; Pb ; free solders – ; Sn ; Zn – ; Sn ; Zn ; Cu
• 刊名：Journal of Materials Engineering and Performance
• 出版年：2012
• 出版时间：May 2012
• 年：2012
• 卷：21
• 期：5
• 页码：648-654
• 全文大小：1.4 MB
• 参考文献：1. Y. Min, L. Xiuzhong, L. Xinghong, and D. Jiahui, Development of Sn-Zn-Cu Lead Free Solder, Conference Proceedings of 11th International Conference ICEPT-HDP, 2010, p 784–788
  2. K.L. Lin and C.L. Shih, Microstructure and Thermal Behavior of Sn-Zn-Ag Solders, J. Electron. Mater., 2003, 32(12), p 1496–1500
  3. K. Suganuma and K.S. Kim, Sn-Zn Low Temperature Solder, J. Mater. Sci. Mater. Electron., 2007, 18(1–3), p 121–127
  4. J. Zhou, Y.S. Sun, and F. Xue, Effect of Nd and La on Surface Tension and Wettability of Sn-8Zn-3Bi, Trans. Nonferrous Met. Soc. China, 2005, 15(5), p 1161–1165
  5. H. Wang, S.B. Xue, W.X. Chen, and J.X. Wang, Effect of Ag, Al, Ga Addition on Wettability of Sn-9Zn Lead-Free Solder, Trans. China Weld. Inst., 2007, 28(8), p 33–36
  6. H. Wang, S.B. Xue, Z.J. Han, and J.X. Wang, Research Status and Prospect of Sn-Zn Based Lead-Free Solders, Weld. J., 2007, 2, p 31–35
  7. S. Wu, H. Kang, and P. Qu, Study of Sn-Zn Lead-Free Solder by Alloying, Electron. Process Technol., 2008, 29(2), p 66–70
  8. X.X. Ren, M. Li, and D.L. Mao, Effect of Alloying Elements on the High-Temperature Oxidation Resistance of Sn-Zn Based Lead-Free Solder, Electron. Compon. Mater., 2004, 23(11), p 40–44
• 作者单位：1. Motor Transport Institute, Centre of Material Testing, Jagiellonska 80, 03-301 Warsow, Poland
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Chemistry
  Characterization and Evaluation Materials
  Materials Science
  Tribology, Corrosion and Coatings
  Quality Control, Reliability, Safety and Risk
  Engineering Design
  
• 出版者：Springer New York
• ISSN：1544-1024

文摘

In oxidizing environments, most tin-based lead (Pb)-free alloys form a tin oxide that is easily eroded or mechanically damaged, affecting corrosion resistance and thus reliability of the soldered joints. In this study, the effect of microstructure heterogeneity on corrosion behavior of Pb-free solder candidate systems has been investigated on the example of as-cast and heat-treated alloys. The research was focused on a comparison between the corrosion resistance of binary Sn-Zn and ternary Sn-Zn-Cu alloys. Accelerated corrosion tests were performed by means of electrochemical methods in the sodium sulfate solution (VI), Na₂SO₄, of about 0.5 M concentration, pH adjusted to 2 by means of concentrated H₂SO₄ acid. In these tests, the corrosion potentials as well as polarization curves were determined for the selected alloys in as-cast state and after their heat treatment using different combinations of processing parameters. The measurements of basic electrochemical characteristics were made, i.e., the corrosion current (i _corr μA/cm2) and Tafel coefficients, both cathodic (b _c V/dec) and anodic (b _a V/dec) ones. Detailed structural characterization of as-cast and heat-treated alloys before and after accelerated corrosion tests has been made under a wide range of magnifications using light microscopy and scanning electron microscopy observations. The results showed that structural heterogeneity of the examined alloys, attributed to the presence of secondary phases, and affected by their size and distribution, significantly influences the behavior of the examined Pb-free Sn-Zn-based alloys in the corrosive environment.