Electrochemical mechanical polishing technology: recent developments and future research and industrial needs

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• 作者：Abd El Khalick Mohammad ; Danwei Wang
• 关键词：Electrochemical mechanical polishing ; Grinding ; Robotics ; Surface finishing and Force control
• 刊名：The International Journal of Advanced Manufacturing Technology
• 出版年：2016
• 出版时间：September 2016
• 年：2016
• 卷：86
• 期：5-8
• 页码：1909-1924
• 全文大小：1,950 KB
• 刊物类别：Engineering
• 刊物主题：Industrial and Production Engineering
  Production and Logistics
  Mechanical Engineering
  Computer-Aided Engineering and Design
  
• 出版者：Springer London
• ISSN：1433-3015
• 卷排序：86

文摘

Electrochemical mechanical (ECM) polishing processes are widely used in various industries such as die and mould manufacturing, turbine blades, and components with complex surfaces. They are used to improve the surface quality and get glossy surfaces with enhanced mechanical properties. In this paper, the authors first look into the fundamental principles of the ECM polishing technology. Then the main parameters that affect the ECM polishing process such as applied voltage, electrolyte concentration, rotational speed and polishing pressure are discussed, and the related research issues are raised. Studying these parameters will enhance the performance, increase the efficiency of ECM polishing technology and provide a useful reference for further developments. Up to date, automatic ECM polishing is limited for planarization process and surfaces with simple geometry such as hole-wall and rotary surfaces. In addition, in some of ECM finishing technologies, the limited available working space usually forces the manufacture to machine one part in multiple stages. Because robots have some advantages over conventional machines such as flexibility, low price and mechanical reconfigurability, they are an effective and economical solution for ECM polishing of geometrically complex workpieces. In order to advance the ECM technology for the next competitive stage where a promising quantitative and qualitative processing is required, the authors proposed that the future researches on ECM polishing should also include ECM polishing using robots. In addition, the authors propose several configurations and setups of robotic ECM polishing systems. The research topics in this area should include designing of new ECM polishing tools, investigating the synergistic effects of additional sources of energies such as magnetic field and ultrasonic vibrations besides the normal effect of ECM tools and developing models and control methods of the processes.