Chemical mechanical paired grinding: a tool for multi-wavelength planarization

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• 作者：Abhijit Chandra ; Ashraf F. Bastawros…
• 关键词：CMP ; CMPG ; Planarization ; Waviness
• 刊名：The International Journal of Advanced Manufacturing Technology
• 出版年：2017
• 出版时间：March 2017
• 年：2017
• 卷：89
• 期：1-4
• 页码：611-617
• 全文大小：
• 刊物类别：Engineering
• 刊物主题：Industrial and Production Engineering; Media Management; Mechanical Engineering; Computer-Aided Engineering (CAD, CAE) and Design;
• 出版者：Springer London
• ISSN：1433-3015
• 卷排序：89

文摘

A new planarization method, chemical mechanical paired grinding (CMPG), is developed by combining strengths of grinding and polishing while avoiding their weaknesses. Surface waviness, a key performance index, is significantly influenced by the induced obliqueness ratio (transverse feed velocity to polishing/grinding wheel velocity) of the CMPG process. The window of planarized wavelengths expanded significantly with increasing obliqueness ratio, while MRR could be enhanced by adjusting rotational speeds of the wheel pair. This endows CMPG with global planarization capabilities, while potentially obviating the MRR vs. planarization efficiency trade-off typical of either fixed abrasive grinding of free abrasive CMP processes.