Measurement of the Temperature Coefficient of Resistance in Metallic Films with Nano-thickness

详细信息    查看全文

• 作者：A. I. Oliva ; J. M. Lugo
• 关键词：Electrical resistance ; Metallic films ; Nano ; thickness ; Temperature coefficient of resistance
• 刊名：International Journal of Thermophysics
• 出版年：2016
• 出版时间：March 2016
• 年：2016
• 卷：37
• 期：3
• 全文大小：505 KB
• 参考文献：1.R. Shabani, H.J. Cho, Rev. Nanosci. Nanotechnol. 1, 85–102 (2012)CrossRef
  2.J.J. Thomson, Proc. Camb. Philos. Soc. 11, 120–123 (1901)
  3.K. Fuchs, Proc. Camb. Philos. Soc. 34, 100–108 (1938)CrossRef ADS
  4.E.H. Sondheimer, Adv. Phys. 50, 499–537 (2001)CrossRef ADS
  5.A.F. Mayadas, M. Shatzkes, Phys. Rev. B. 1, 1382–1389 (1970)CrossRef ADS
  6.K. Chu, S.C. Lee, S. Lee, D. Kim, Ch. Moon, S.H. Park, Nanoscale 7, 471–478 (2015)CrossRef ADS
  7.J. Zelenka, V. Chudoba, J. Rehak, K. Rohacek, Thin Solid Films 200, 239–246 (1991)CrossRef ADS
  8.M. Merzlyakov, Thermochim. Acta 442, 52–60 (2006)CrossRef
  9.G.E. Fernandes, J.H. Kim, A.K. Sood, J. Xu, Adv. Funct. Mater. 23, 4678–4683 (2013)
  10.A.R. Patel, G.K. Shivakumar, N.C. Pandya, N.C. Chourasia, Mater. Lett. 1, 181–183 (1983)CrossRef
  11.C.R. Tellier, A.J. Tosser, Thin Solid Films 52, 53–61 (1978)CrossRef ADS
  12.A.A. Cottey, Thin Solid Films 1, 297–307 (1968)CrossRef ADS
  13.C.R. Tellier, A.J. Tosser, Thin Solid Films 44, 141–147 (1977)CrossRef ADS
  14.J.M. Camacho, A.I. Oliva, Thin Solid Films 515, 1881–1885 (2006)CrossRef ADS
  15.A.I. Oliva, E. Anguiano, J.L. Sacedón, M. Aguilar, J.A. Méndez, J.A. Aznárez, Phys. Rev. B. 60, 2720–2727 (1999)CrossRef ADS
  16.R.D. Maldonado, A.I. Oliva, H.G. Riveros, Surf. Rev. Lett. 13, 557–565 (2006)CrossRef
  17.J. Iijima, J.W. Lim, S.H. Hong, S. Suzuki, K. Mimura, M. Isshiki, Appl. Surf. Sci. 253, 2825–2829 (2005)CrossRef ADS
  18.J. M. Lugo, A. I. Oliva, H.G. Riveros, O. Ceh, in 7th International Conference on Electrical Engineering, Computing Science and Automatic Control (CCE) (IEEE Publication, Piscataway, NJ, 2010), pp. 504–509
  19.J.M. Lugo, V. Rejón, A.I. Oliva, J. Heat Transf. 137, 051601–051611 (2015)CrossRef
  20.J.M. Lugo, C. Ayora, V. Rejon, A.I. Oliva, Thin Solid Films 585, 24–30 (2015)CrossRef ADS
  21.J.M. Lugo, A.I. Oliva, J. Thermophys. Heat Transf. (in press) (2015)
  22.D.R. Lide, CRC Handbook of Chemistry and Physics, 87th edn. (Taylor and Francis, Boca Raton, 2006)
  23.E.B. Jones, B.E. Noltingk, Jones’ Instrument Technology: Measurement of Temperature and Chemical Composition, vol. 2, 4th edn. (Butterworth-Heinemann, London, 1992)
  
• 作者单位：A. I. Oliva (1)
  J. M. Lugo (1)
  
  1. Departamento de Física Aplicada, Centro de Investigación y de Estudios Avanzados del IPN-Unidad Mérida, A.P. 73-Cordemex, 97310, Mérida, Yucatán, Mexico
  
• 刊物类别：Physics and Astronomy
• 刊物主题：Physics
  Condensed Matter
  Mechanics
  Industrial Chemistry and Chemical Engineering
  Physical Chemistry
  
• 出版者：Springer Netherlands
• ISSN：1572-9567

文摘

The temperature coefficient of resistance (TCR) values of gold and aluminum films deposited on glass substrates were obtained in the range of thickness from 20 nm to 200 nm at 298 K and atmospheric pressure conditions. Applying an electrical current and measuring simultaneously the corresponding changes of voltage (i.e., electrical resistance), and the change of temperature on the thin films, the TCR value was estimated. The measured TCR values show a decrement with the film thickness reduction, and their values are approximately 13.0 % lower than their corresponding bulk values mainly for thinner films. A comparison with previously reported cooper TCR values and the values estimated with the Tellier–Tosser model show good agreement with differences of about 5.0 % between them.