Improvements of mechanical fatigue reliability of Cu interconnects on flexible substrates through MoTi alloy under-layer

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• 作者：Young-Joo Lee (1)
  Hae-A-Seul Shin (1)
  Dae-Hyun Nam (1)
  Han-Wool Yeon (1)
  Boae Nam (2)
  Kyoohee Woo (3)
  Young-Chang Joo (1) (4)
  
  1. Department of Materials Science & Engineering ; Seoul National University ; Seoul ; 151-744 ; Korea
  2. LG Display Research and Development Center ; LG Display Co. Ltd. ; Paju ; 413-779 ; Korea
  3. Advanced Manufacturing Systems Research Division ; Korea Institute of Machinery and Materials ; Daejeon ; 305-343 ; Korea
  4. Research Institute of Advanced Materials (RIAM) ; Seoul National University ; Seoul ; 151-742 ; Korea
  
• 关键词：flexible electronics ; mechanical reliability ; fatigue ; Cu interconnects
• 刊名：Electronic Materials Letters
• 出版年：2015
• 出版时间：January 2015
• 年：2015
• 卷：11
• 期：1
• 页码：149-154
• 全文大小：922 KB
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• 刊物类别：Chemistry and Materials Science
• 刊物主题：Condensed Matter Physics
  Electronics, Microelectronics and Instrumentation
  Optical and Electronic Materials
  Thermodynamics
  Characterization and Evaluation of Materials
  
• 出版者：The Korean Institute of Metals and Materials, co-published with Springer Netherlands
• ISSN：2093-6788

文摘

The mechanical fatigue of Cu films and lines on flexible substrates was investigated, and an improvement in the structures through the use of a MoTi alloy under-layer was proposed. Fatigue reliability was decreased by 3-fold in lines compared with films in the tensile condition and by 6-fold in the compressive condition. Crack formation was observed to be more detrimental for lines than for films. With a MoTi under-layer, the fatigue limit was increased by 2 times that of a structure without MoTi in the tensile condition and by 15 times in the compressive bending condition. The suppression of delamination through the use of a MoTi under-layer improved the fatigue reliability under compressive bending.