Inkjet printing of copper wire on PET substrate

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• 作者：E. Y. Wang ; Xuezhao Li ; Y. N. Duan
• 关键词：Copper patterns ; Inkjet printing ; PET substrate ; Electroless plating ; Ion adsorption
• 刊名：Applied Nanoscience
• 出版年：2016
• 出版时间：April 2016
• 年：2016
• 卷：6
• 期：4
• 页码：575-580
• 全文大小：999 KB
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Materials Science
  Nanotechnology
  
• 出版者：Springer Berlin / Heidelberg
• ISSN：2190-5517

文摘

A new process to fabricate copper pattern on PET substrate is developed in the experiment. Functional ink with ion-adsorption nanoparticles was printed on PET substrate to form the pattern adsorption film. Catalytic ion was adsorbed by amino groups in the adsorption film to catalyze the electroless plating process of copper. The mercapto groups were introduced to the film to enhance the reliability of patterns. In addition, the specific solvent was used in the ink to increase the surface roughness of adsorption film which leads to a better adhesion of the patterns. The conductivity of prepared copper patterns is the same as bulk copper and the patterns show good adhesion on PET substrate.