A model-based prognostic approach to predict interconnect failure using impedance analysis

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• 作者：Daeil Kwon ; Jeongah Yoon
• 关键词：Prognostics ; Solder joint reliability ; Bayesian tracking ; Interconnect
• 刊名：Journal of Mechanical Science and Technology
• 出版年：2016
• 出版时间：October 2016
• 年：2016
• 卷：30
• 期：10
• 页码：4447-4452
• 全文大小：453 KB
• 刊物类别：Engineering
• 刊物主题：Mechanical Engineering
  Structural Mechanics
  Control Engineering
  Industrial and Production Engineering
  
• 出版者：The Korean Society of Mechanical Engineers
• ISSN：1976-3824
• 卷排序：30

文摘

The reliability of electronic assemblies is largely affected by the health of interconnects, such as solder joints, which provide mechanical, electrical and thermal connections between circuit components. During field lifecycle conditions, interconnects are often subjected to a DC open circuit, one of the most common interconnect failure modes, due to cracking. An interconnect damaged by cracking is sometimes extremely hard to detect when it is a part of a daisy-chain structure, neighboring with other healthy interconnects that have not yet cracked. This cracked interconnect may seem to provide a good electrical contact due to the compressive load applied by the neighboring healthy interconnects, but it can cause the occasional loss of electrical continuity under operational and environmental loading conditions in field applications. Thus, cracked interconnects can lead to the intermittent failure of electronic assemblies and eventually to permanent failure of the product or the system. This paper introduces a model-based prognostic approach to quantitatively detect and predict interconnect failure using impedance analysis and particle filtering. Impedance analysis was previously reported as a sensitive means of detecting incipient changes at the surface of interconnects, such as cracking, based on the continuous monitoring of RF impedance. To predict the time to failure, particle filtering was used as a prognostic approach using the Paris model to address the fatigue crack growth. To validate this approach, mechanical fatigue tests were conducted with continuous monitoring of RF impedance while degrading the solder joints under test due to fatigue cracking. The test results showed the RF impedance consistently increased as the solder joints were degraded due to the growth of cracks, and particle filtering predicted the time to failure of the interconnects similarly to their actual timesto- failure based on the early sensitivity of RF impedance.