Assessment of Joint Reliability of Sn᾿.5Ag᾿.5Cu Solder/Cu as a Function of Reflow Time
详细信息 查看全文
- 作者：Mrunali Sona ; K. Narayan Prabhu
- 关键词：Lead ; free solders ; IMC ; Shear strength
- 刊名：Transactions of the Indian Institute of Metals
- 出版年：2016
- 出版时间：May 2016
- 年：2016
- 卷：69
- 期：4
- 页码：941-947
- 全文大小：1,433 KB
- 参考文献：1.Hammad A E, Mater Des 50 (2013) 108.CrossRef
2. Chen T, and Dutta I, J Electron Mater 37 (2008) 347.CrossRef
3.Keller J, Baither D, Wilke U, and Schmitz G, Acta Mater 59 (2011) 2731.CrossRef
4.Watanabe H, Hidaka N, Shoji I, and Ito M, in Proceedings of Materials Science and Technology (MS&T) (2006) 135.
5.Lee J H, Yu A M, Kim J H, Kim M S, and Kang N, Met Mater Int 14 (2008) 649.CrossRef
6. Sona M, and Prabhu K N, J Mater Sci Mater Electron 24 (2013) 3149.CrossRef
7.Lee J G, and Subramanian K N, J Electron Mater 32 (2003) 523.CrossRef
8.Sona M, and Prabhu K N, J Mater Sci Mater Electron 25 (2014) 1446.CrossRef
9.Mookam N, and Kanlayasiri K, J Mater Sci Technol 28 (2012) 53.CrossRef
10.Abtew M, and Selvaduray G, Mater Sci Eng 27 (2000) 95.CrossRef
11.Chung C K, Duh J G, and Kao C R, Scr Mater 63 (2010) 258.CrossRef
12.Laurila T, Vuorinen V, and Kivilahti J K, Mater Sci Eng R 49 (2005) 1.CrossRef
13.Lee L M, and Mohamad A A, Adv Mater Sci Eng. doi:10.1155/2013/123697 . - 作者单位：Mrunali Sona (1)
K. Narayan Prabhu (1)
1. Department of Metallurgical & Materials Engineering, National Institute of Technology Karnataka, Surathkal, Mangalore, 575 025, India - 刊物类别：Chemistry and Materials Science
- 刊物主题：Materials Science
Metallic Materials
Materials Science, general
Tribology, Corrosion and Coatings - 出版者：Springer India
- ISSN：0975-1645
文摘
Solder interconnect reliability is exceedingly influenced by the solder material properties, the intermetallics formed during soldering, and the environmentally imposed loads. The current study involves the study of the wetting behaviour, interfacial reactions and growth of intermetallic compounds (IMCs) in Sn–2.5Ag–0.5Cu lead free solder solidified on Cu substrate as function of reflow time. The reflow temperature was maintained at 270 °C and reflow time was varied from 10 to 10,000 s. The solder alloy showed better wettability on the substrate with the increase in reflow time. A growth in Cu6Sn5 IMC thickness was observed up to a reflow time of 500 s. IMC layer formed during a reflow time of 10 s was 3.09 μm and its thickness increased to 4.40, 8.21, 10.96 μm during 100, 300 and 500 s reflow time respectively. A decrease in the thickness of IMC was observed for samples reflowed for 1000 s. The IMC thickness increased with further increase in reflow time. The joint reliability of Sn–2.5Ag–0.5Cu solder solidified on copper substrate surfaces was assessed by performing bond shear test. The average shear strength decreased with an increase in reflow time after an optimum value.