Ni/Cu/Ag plated contacts: A study of resistivity and contact adhesion for crystalline-Si solar cells

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• 作者：Atteq ur Rehman ; Sang Hee Lee ; Muhammad Fahad Bhopal…
• 刊名：Electronic Materials Letters
• 出版年：2016
• 出版时间：July 2016
• 年：2016
• 卷：12
• 期：4
• 页码：439-444
• 全文大小：1,546 KB
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Condensed Matter Physics
  Electronics, Microelectronics and Instrumentation
  Optical and Electronic Materials
  Thermodynamics
  Characterization and Evaluation of Materials
  
• 出版者：The Korean Institute of Metals and Materials, co-published with Springer Netherlands
• ISSN：2093-6788
• 卷排序：12

文摘

Ni/Cu/Ag plated contacts were examined as an alternate to Ag screen printed contacts for silicon (Si) solar cell metallization. To realize a reliable contact for industrial applications, the contact resistance and its adhesion to Si substrates were evaluated. Si surface roughness by picosecond (ps) laser ablation of silicon-nitride (SiNx) antireflection coating (ARC) was done in order to prepare the patterns. The sintering process after Ni/Cu/Ag full metallization in the form of the post-annealing process was applied to investigate the contact resistivity and adhesion. A very low contact resistivity of approximately 0.5 mΩcm2 has been achieved with measurements made by the transfer length method (TLM). Thin finger lines of about 26 μm wide and a line resistance of 0.51 Ω/cm have been realized by plating technology. Improved contact adhesion by combining the ps-laser-ablation and post-annealing process has been achieved. We have shown the peel-off strengths >1 N/mm with a higher average adhesion of 1.9 N/mm. Our pull-tab adhesion tests demonstrate excellent strength well above the wafer breakage force.